Appendix F: Space Systems

APPENDIX F: SPACE SYSTEMS WORK BREAKDOWN STRUCTURE AND DEFINITIONS F.1 SCOPE This appendix provides the Work Breakdown Structure and Definitions for Space Vehicles, Ground Segments, Orbital Transfer Vehicles, and Launch Vehicles as they relate to Earth-Orbiting, Unmanned Space Systems. This WBS may also be used for interplanetary and other missions. However, additional WBS elements (for example, probes) may be required. Definitions for WBS elements common to the Space System are defined in Appendix L: Common Elements, Work Breakdown Structures and Definitions in section L.4.

F.2 APPLICABLE DOCUMENTS

F.2.1 Non-Government publications. The following documents form a part of this document to the extent specified herein.

AMERICAN NATIONAL STANDARDS INSTITUTE (ANSI) ANSI/IEEE STD 610.12-1990 (R2002), Standard Glossary of Software Engineering Terminology ANSI Standards can be found online at: http://webstore.ansi.org

ANSI Customer Service 25 W 43rd Street, 4th Floor New York, NY, 10036

or

The Institute of Electrical and Electronics Engineers, Inc. (IEEE) Operations Center 445 Hoes Lane Piscataway, NJ 08854-4141 www.ieee.org

F.3 WORK BREAKDOWN STRUCTURE LEVELS

• 1.0Space System
  • 1.1SEIT/PM and Support Equipment (1…s) 1
    • 1.1.1Systems Engineering
    • 1.1.2Assembly, Integration and Test
    • 1.1.3Program Management
    • 1.1.4Support Equipment
  • 1.2Space Vehicle 1..n (Specify)2
    • 1.2.1SEIT/PM and Support Equipment
      • 1.2.1.1Systems Engineering
      • 1.2.1.2Assembly, Integration and Test
      • 1.2.1.3Program Management
      • 1.2.1.4Support Equipment
    • 1.2.2Bus
      • 1.2.2.1SEIT/PM and Support Equipment
        • 1.2.2.1.1Systems Engineering
        • 1.2.2.1.2Assembly, Integration and Test
        • 1.2.2.1.3Program Management
        • 1.2.2.1.4Support Equipment
      • 1.2.2.2Structures and Mechanisms (SMS)
        • 1.2.2.2.1SEPM
        • 1.2.2.2.2Assembly, Integration and Test
        • 1.2.2.2.3Support Equipment
        • 1.2.2.2.4Structures
        • 1.2.2.2.5Mechanisms and Pyrotechnics
        • 1.2.2.2.6SMS Other
      • 1.2.2.3Thermal Control (TCS)
        • 1.2.2.3.1SEPM
        • 1.2.2.3.2Assembly, Integration and Test
        • 1.2.2.3.3Support Equipment
        • 1.2.2.3.4Cryogenic Devices
        • 1.2.2.3.5Liquid Loops
        • 1.2.2.3.6Electric Coolers
        • 1.2.2.3.7Heaters, Thermisters and Thermostats
        • 1.2.2.3.8Passive Devices
        • 1.2.2.3.9TCS Other
      • 1.2.2.4Electrical Power (EPS)
        • 1.2.2.4.1SEPM
        • 1.2.2.4.2Assembly, Integration and Test
        • 1.2.2.4.3Support Equipment
        • 1.2.2.4.4Solar Array
        • 1.2.2.4.5Solar Array Positioner
        • 1.2.2.4.6Radioisotope Thermionic Generator
        • 1.2.2.4.7Other Power Sources
        • 1.2.2.4.8Power Control, Switching and Distribution Electronics
        • 1.2.2.4.9Power Conditioning, Conversion and Regulation
        • 1.2.2.4.10Power Dissipation Devices
        • 1.2.2.4.11Rechargeable Batteries
        • 1.2.2.4.12Charge Control Electronics
        • 1.2.2.4.13Harnesses and Cables
        • 1.2.2.4.14EPS Other
      • 1.2.2.5Attitude Control (ACS)
        • 1.2.2.5.1SEPM
        • 1.2.2.5.2Assembly, Integration and Test
        • 1.2.2.5.3Support Equipment
        • 1.2.2.5.4Star Tracker/Sensors 1…n (Specify)
        • 1.2.2.5.5Earth (Horizon) Sensors 1…n (Specify)
        • 1.2.2.5.6Sun Sensors 1…n (Specify)
        • 1.2.2.5.7Magnetometers
        • 1.2.2.5.8Global Positioning System (GPS) Receiver
        • 1.2.2.5.9Inertial Reference Unit-IRU / Inertial Measurement Unit-IMU 1…n (Specify)
        • 1.2.2.5.10Rate Gyros 1…n (Specify)
        • 1.2.2.5.11Accelerometers 1…n (Specify)
        • 1.2.2.5.12Bearing and Power Transfer Assy (BAPTA)
        • 1.2.2.5.13Attitude Control Wheels 1…n (Specify)
        • 1.2.2.5.14Magnetic Control Devices
        • 1.2.2.5.15Spin Control Devices
        • 1.2.2.5.16Control Electronics 1…n (Specify)
        • 1.2.2.5.17ACS Other
      • 1.2.2.6Propulsion 1..n (Specify)
        • 1.2.2.6.1SEPM
        • 1.2.2.6.2Assembly, Integration and Test
        • 1.2.2.6.3Support Equipment
        • 1.2.2.6.4Tanks 1…n (Specify)
        • 1.2.2.6.5Plumbing
        • 1.2.2.6.6Thrusters 1…n (Specify)
        • 1.2.2.6.7Solid Rocket Motors
        • 1.2.2.6.8Liquid Propellant and Pressurant
        • 1.2.2.6.9Power Electronics
        • 1.2.2.6.10Propulsion Other
      • 1.2.2.7Telemetry, Tracking, and Command (TTandC)
        • 1.2.2.7.1SEPM
        • 1.2.2.7.2Assembly, Integration and Test
        • 1.2.2.7.3Support Equipment
        • 1.2.2.7.4Antennas
        • 1.2.2.7.5Passive Signal Flow Control
        • 1.2.2.7.6Transmitter/Receiver/Transceiver/Transponder 1..n (Specify)
        • 1.2.2.7.7Modulators/Demodulators/Modems
        • 1.2.2.7.8Amplifiers
        • 1.2.2.7.9Frequency Upconverter/Downconverter
        • 1.2.2.7.10Computers and Processors 1…n (Specify)
        • 1.2.2.7.11Command/Telemetry Units 1…n (Specify)
        • 1.2.2.7.12Command Sensors 1…n (Specify)
        • 1.2.2.7.13Frequency and Timing
        • 1.2.2.7.14Signal Conditioners
        • 1.2.2.7.15Communications Security 1…n (Specify)
        • 1.2.2.7.16Data Storage, Handling and Interface 1…n (Specify)
        • 1.2.2.7.17TTandC Other
      • 1.2.2.8Bus Flight Software
        • 1.2.2.8.1SEPM
        • 1.2.2.8.2Assembly, Integration and Test
        • 1.2.2.8.3Support Equipment
        • 1.2.2.8.4CSCI 1…n (Specify)
    • 1.2.3SEIT/PM and Support Equipment (If applicable for integration of Multiple Payloads)
      • 1.2.3.1Systems Engineering
      • 1.2.3.2Assembly, Integration and Test
      • 1.2.3.3Program Management
      • 1.2.3.4Support Equipment
    • 1.2.4Payload 1…n (Specify)
      • 1.2.4.1SEIT/PM and Support Equipment
        • 1.2.4.1.1Systems Engineering
        • 1.2.4.1.2Assembly, Integration and Test
        • 1.2.4.1.3Program Management
        • 1.2.4.1.4Support Equipment
      • 1.2.4.2Structures and Mechanisms
        • 1.2.4.2.1SEPM
        • 1.2.4.2.2Assembly, Integration and Test
        • 1.2.4.2.3Support Equipment
        • 1.2.4.2.4Structures
        • 1.2.4.2.5Mechanisms and Pyrotechnics
        • 1.2.4.2.6Structures and Mechanisms Other
      • 1.2.4.3Thermal Control
        • 1.2.4.3.1SEPM
        • 1.2.4.3.2Assembly, Integration and Test
        • 1.2.4.3.3Support Equipment
        • 1.2.4.3.4Cryogenic Devices
        • 1.2.4.3.5Liquid Loops
        • 1.2.4.3.6Electric Coolers
        • 1.2.4.3.7Electric Heaters, Thermisters and Thermostats
        • 1.2.4.3.8Passive Devices
        • 1.2.4.3.9Sun Shields
        • 1.2.4.3.10Thermal Control Other
      • 1.2.4.4Electrical Power
        • 1.2.4.4.1SEPM
        • 1.2.4.4.2Assembly, Integration and Test
        • 1.2.4.4.3Support Equipment
        • 1.2.4.4.4Power Sources
        • 1.2.4.4.5Power Control Switching and Distribution Electronics
        • 1.2.4.4.6Power Conditioning, Conversion and Regulation
        • 1.2.4.4.7Harnesses and Cables
        • 1.2.4.4.8Electrical Power Other
      • 1.2.4.5Pointing, Command, and Control Interface
        • 1.2.4.5.1SEPM
        • 1.2.4.5.2Assembly, Integration and Test
        • 1.2.4.5.3Support Equipment
        • 1.2.4.5.4Computers and Processors 1…n (Specify)
        • 1.2.4.5.5Command/Telemetry Units 1…n (Specify)
        • 1.2.4.5.6Control Electronics 1…n (Specify)
        • 1.2.4.5.7Pointing Sensors 1…n (Specify)
        • 1.2.4.5.8Payload Positioners1…n (Specify)
        • 1.2.4.5.9Security, Encryption and Decryption Devices1…n (Specify)
        • 1.2.4.5.10Data Storage, Handling and Interface 1…n (Specify)
        • 1.2.4.5.11Multifunctional Digital Electronic Boxes 1…n (Specify)
        • 1.2.4.5.12Pointing, Command, and Control Interface Other
      • 1.2.4.6Payload Antenna1..n (Specify)
        • 1.2.4.6.1SEPM
        • 1.2.4.6.2Assembly, Integration and Test
        • 1.2.4.6.3Support Equipment
        • 1.2.4.6.4Structures and Mechanisms
        • 1.2.4.6.5Antenna Positioners
        • 1.2.4.6.6Reflector/Horn1…n (Specify)
        • 1.2.4.6.7Feed1…n (Specify)
        • 1.2.4.6.8Waveguide/Coax/Cabling
        • 1.2.4.6.9Transmit/Receive Modules
        • 1.2.4.6.10Antenna Other
      • 1.2.4.7Payload Signal Electronics
        • 1.2.4.7.1SEPM
        • 1.2.4.7.2Assembly, Integration and Test
        • 1.2.4.7.3Support Equipment
        • 1.2.4.7.4Passive Signal Flow Control
        • 1.2.4.7.5Transmitter/Receiver/Transceiver/Transponder 1…n (Specify)
        • 1.2.4.7.6Modulators/Demodulators/Modems 1…n (Specify)
        • 1.2.4.7.7Multiplexers/Demultiplexers 1…n (Specify)
        • 1.2.4.7.8Amplifiers 1…n (Specify)
        • 1.2.4.7.9Frequency Upconverters/Downconverters 1…n (Specify)
        • 1.2.4.7.10Frequency and Timing 1…n (Specify)
        • 1.2.4.7.11Signal Conditioners 1…n (Specify)
        • 1.2.4.7.12Multifunctional Signal Electronic Boxes 1…n (Specify)
        • 1.2.4.7.13Signal Electronics Other
      • 1.2.4.8Optical Assembly
        • 1.2.4.8.1SEPM
        • 1.2.4.8.2Assembly, Integration and Test
        • 1.2.4.8.3Support Equipment
        • 1.2.4.8.4Structure/Outerbarrel/Cover
        • 1.2.4.8.5Mirrors and Optics 1…n (Specify)
        • 1.2.4.8.6Aft Optics Assembly
        • 1.2.4.8.7Alignment and Calibration 1…n (Specify)
        • 1.2.4.8.8Optical Assembly Other
      • 1.2.4.9Sensor
        • 1.2.4.9.1SEPM
        • 1.2.4.9.2Assembly, Integration and Test
        • 1.2.4.9.3Support Equipment
        • 1.2.4.9.4Enclosure 1..n (Specify)
        • 1.2.4.9.5Focal Plane Array 1…n (Specify)
        • 1.2.4.9.6Sensor Positioners 1…n (Specify)
        • 1.2.4.9.7Sensor Electronics 1…n (Specify)
        • 1.2.4.9.8Alignment and Calibration 1…n (Specify)
        • 1.2.4.9.9Magnetometer (1…n (Specify) )
        • 1.2.4.9.10Spectrometer 1…n (Specify)
        • 1.2.4.9.11Radiometer 1…n (Specify)
        • 1.2.4.9.12Camera 1…n (Specify)
        • 1.2.4.9.13Sounder 1…n (Specify)
        • 1.2.4.9.14Other Sensor Types 1…n (Specify)
        • 1.2.4.9.15Mission Sensor Other
      • 1.2.4.10Payload Flight Software
        • 1.2.4.10.1SEPM
        • 1.2.4.10.2Assembly, Integration and Test
        • 1.2.4.10.3Support Equipment
        • 1.2.4.10.4CSCI 1…n (Specify)
      • 1.2.4.11Payload Other
    • 1.2.5Booster Adapter
    • 1.2.6Space Vehicle Storage
    • 1.2.7Launch Systems Integration (LSI)
    • 1.2.8Launch Operations
    • 1.2.9Mission Operations Support
    • 1.2.10Space Vehicle Other
  • 1.3Ground Operations and Processing Center 1…n (Specify) 2
    • 1.3.1SEIT/PM and Support Equipment
      • 1.3.1.1Systems Engineering
      • 1.3.1.2Assembly, Integration and Test
      • 1.3.1.3Program Management
      • 1.3.1.4Support Equipment
    • 1.3.2Function (1…F) 3
      • 1.3.2.1SEIT/PM and Support Equipment
        • 1.3.2.1.1Systems Engineering
        • 1.3.2.1.2Assembly, Integration and Test
        • 1.3.2.1.3Program Management
        • 1.3.2.1.4Support Equipment
      • 1.3.2.2COTS Hardware
        • 1.3.2.2.1SEPM
        • 1.3.2.2.2Assembly, Integration and Test
        • 1.3.2.2.3Support Equipment
        • 1.3.2.2.4Workstations 1…n (Specify)
        • 1.3.2.2.5Servers 1…n (Specify)
        • 1.3.2.2.6Storage and Archive 1…n (Specify)
        • 1.3.2.2.7network Equipment
        • 1.3.2.2.8Interface Equipment
        • 1.3.2.2.9Security Encryption/Decryption 1…n (Specify)
        • 1.3.2.2.10Data Processing 1…n (Specify)
        • 1.3.2.2.11COTS Hardware Other
        • 1.3.2.2.12Pre-Ops Maintenance 1…n (Specify)
      • 1.3.2.3Custom Hardware
        • 1.3.2.3.1SEPM
        • 1.3.2.3.2Assembly, Integration and Test
        • 1.3.2.3.3Support Equipment
        • 1.3.2.3.4Custom Hardware Configured Item 1…n (Specify)
        • 1.3.2.3.5Pre-Ops Maintenance 1…n (Specify)
      • 1.3.2.4GOPC Software
        • 1.3.2.4.1SEPM
        • 1.3.2.4.2Assembly, Integration and Test
        • 1.3.2.4.3Support Equipment
        • 1.3.2.4.4CSCI 1..n (Specify)
        • 1.3.2.4.5Pre-Ops Maintenance 1…n (Specify)
      • 1.3.2.5Pre-Operations Mission Support
  • 1.4Ground Terminal/Gateway (GT) 1…n (Specify) 2
    • 1.4.1SEIT/PM and Support Equipment
      • 1.4.1.1Systems Engineering
      • 1.4.1.2Assembly, Integration and Test
      • 1.4.1.3Program Management
      • 1.4.1.4Support Equipment
    • 1.4.2Antenna 1..n (Specify)
      • 1.4.2.1SEPM
      • 1.4.2.2Assembly, Integration and Test
      • 1.4.2.3Support Equipment
      • 1.4.2.4Pedestal
      • 1.4.2.5Radome
      • 1.4.2.6Other Structure and Mechanisms
      • 1.4.2.7Aperture
      • 1.4.2.8Feed 1…n (Specify)
      • 1.4.2.9Waveguide/Coax/Cabling
      • 1.4.2.10Antenna Other
    • 1.4.3Optical Communication Assembly 1…n (Specify)
      • 1.4.3.1SEPM
      • 1.4.3.2Assembly, Integration and Test
      • 1.4.3.3Support Equipment
      • 1.4.3.4Structure/Outerbarrel/Cover
      • 1.4.3.5Mirror/Optics 1..n (Specify)
      • 1.4.3.6Aft Optics and Bench
      • 1.4.3.7Alignment Sensors/Calibration
      • 1.4.3.8Optical Assembly Other
    • 1.4.4RF Electronics (Band 1…n (Specify))
      • 1.4.4.1SEPM
      • 1.4.4.2Assembly, Integration and Test
      • 1.4.4.3Support Equipment
      • 1.4.4.4Passive Signal Flow Control
      • 1.4.4.5Transmitter/Receiver/Transceiver/Transponder 1…n (Specify)
      • 1.4.4.6Modulators/Demodulators/Modems 1…n (Specify)
      • 1.4.4.7Multiplexers/Demultiplexers 1…n (Specify)
      • 1.4.4.8Power Amplifiers 1…n (Specify)
      • 1.4.4.9Frequency Upconverters/Downconverters 1…n (Specify)
      • 1.4.4.10Signal Conditioners 1…n (Specify)
      • 1.4.4.11Signal Electronic Boxes 1…n (Specify)
      • 1.4.4.12Focal Plane Array 1…n (Specify)
      • 1.4.4.13RF Electronics Other
    • 1.4.5Timing
      • 1.4.5.1SEPM
      • 1.4.5.2Assembly, Integration and Test
      • 1.4.5.3Support Equipment
      • 1.4.5.4Receiver
      • 1.4.5.5Antenna 1…n (Specify)
      • 1.4.5.6Frequency and Timing Generators
      • 1.4.5.7Amplifier and Distribution 1…n (Specify)
      • 1.4.5.8Timing Other
    • 1.4.6Baseband-network
      • 1.4.6.1SEPM
      • 1.4.6.2Assembly, Integration and Test
      • 1.4.6.3Support Equipment
      • 1.4.6.4Switches/Hubs and Routers
      • 1.4.6.5network Interface and Other Hardware
      • 1.4.6.6Modems
      • 1.4.6.7Security/Encryption and Decryption Devices 1…n (Specify)
      • 1.4.6.8Baseband-network Electronic Boxes 1…n (Specify)
      • 1.4.6.9Baseband-network Other
    • 1.4.7Monitor and Control Hardware
      • 1.4.7.1SEPM
      • 1.4.7.2Assembly, Integration and Test
      • 1.4.7.3Support Equipment
      • 1.4.7.4Workstations 1…n (Specify)
      • 1.4.7.5Servers 1…n (Specify)
      • 1.4.7.6Hardware Configured Item 1…n (Specify)
    • 1.4.8GT Software
      • 1.4.8.1SEPM
      • 1.4.8.2Assembly, Integration and Test
      • 1.4.8.3Support Equipment
      • 1.4.8.4CSCI 1…n (Specify)
    • 1.4.9Pre-Operations Maintenance 1…n (Specify)
    • 1.4.10Pre-Operations Mission Support
  • 1.5External network (T-COMM)
    • 1.5.1SEIT/PM and Support Equipment
      • 1.5.1.1Systems Engineering
      • 1.5.1.2Assembly, Integration and Test
      • 1.5.1.3Program Management
      • 1.5.1.4Support Equipment
    • 1.5.2Leased Circuits
      • 1.5.2.1Leased Circuit 1…n (Specify)
    • 1.5.3Purchased Circuits
      • 1.5.3.1Purchased Circuit 1…n (Specify)
      • 1.5.3.2Pre-Ops Maintenance 1…n (Specify)
  • 1.6User Equipment
    • 1.6.1SEIT/PM and Support Equipment
      • 1.6.1.1Systems Engineering
      • 1.6.1.2Assembly, Integration and Test
      • 1.6.1.3Program Management
      • 1.6.1.4Support Equipment
    • 1.6.2Equipment 1..n (Specify)
      • 1.6.2.1SEPM
      • 1.6.2.2Assembly, Integration and Test
      • 1.6.2.3Support Equipment
      • 1.6.2.4Hardware Configured Item 1…n (Specify)
      • 1.6.2.5CSCI 1…n (Specify)
    • 1.6.3Pre-Ops Maintenance 1…n (Specify)
  • 1.7Facilities 1..n (Specify)
    • 1.7.1SEIT/PM and Support Equipment
      • 1.7.1.1Systems Engineering
      • 1.7.1.2Assembly, Integration and Test
      • 1.7.1.3Program Management
      • 1.7.1.4Support Equipment
    • 1.7.2Site Preparation
      • 1.7.2.1SEPM
      • 1.7.2.2Assembly, Integration and Test
      • 1.7.2.3Support Equipment
      • 1.7.2.4Graded Land
      • 1.7.2.5Roads
      • 1.7.2.6Pads
      • 1.7.2.7Retaining Walls / Fencing
      • 1.7.2.8Utilities
      • 1.7.2.9Site Preparation Other
    • 1.7.3Landscape
    • 1.7.4Buildings 1…n (Specify)
      • 1.7.4.1SEPM
      • 1.7.4.2Assembly, Integration and Test
      • 1.7.4.3Support Equipment
      • 1.7.4.4Foundation and Sub Structure
      • 1.7.4.5Superstructure and Finishing
      • 1.7.4.6Buildings Other
    • 1.7.5Equipment and Building Fit Out 1…n (Specify)
      • 1.7.5.1SEPM
      • 1.7.5.2Assembly, Integration and Test
      • 1.7.5.3Support Equipment
      • 1.7.5.4HVAC
      • 1.7.5.5Power Conditioning/UPS
      • 1.7.5.6network Wiring/Cable Trays
      • 1.7.5.7Generators
      • 1.7.5.8Computer Flooring
      • 1.7.5.9Appliances
      • 1.7.5.10Furniture
      • 1.7.5.11Equipment and Building Fit Out Other
    • 1.7.6Pre-Operations Maintenance 1…n (Specify)
  • 1.8Vehicles and Shelters
    • 1.8.1SEIT/PM and Support Equipment
      • 1.8.1.1Systems Engineering
      • 1.8.1.2Assembly, Integration and Test
      • 1.8.1.3Program Management
      • 1.8.1.4Support Equipment
    • 1.8.2Vehicles
      • 1.8.2.1Vehicle 1…n (Specify)
    • 1.8.3Shelters
      • 1.8.3.1Shelter 1…n (Specify)
    • 1.8.4Pre-Operations Maintenance 1…n (Specify)
  • 1.9Insurance
    • 1.9.1SEPM
    • 1.9.2Insurance Policy
    • 1.9.3Insurance Settlements
  • 1.10Task Orders
    • 1.10.1Task Order 1…n (Specify)
  • 1.11Orbital Transfer Vehicle (OTV)
  • 1.12Launch Vehicle 1…n (Specify)

F.3.1 Application of Common WBS Elements as they pertain to Space (Appendix L – Section L.4) (including SEIT/PM and Support Equipment). Normally, WBS elements that are common (i.e., Integration, Assembly, Test and Checkout; Systems Engineering; Program Management; Acquisition Logistics; System Test and Evaluation; Training; and Data) should be applied to the appropriate levels within the WBS for which they support; however, Space System Work Breakdown Structure, all common elements, applicable to Space Systems are now captured within Appendix F. The following new elements are now included as part of Appendix-F: Systems Engineering, Integration and Test, Program Management, and Support Equipment. Systems Engineering and Program Management are combined into a single SEPM element at Level 5. These elements are found throughout all levels of a WBS. Definitions for the Space Unique Common WBS elements, and all other defense materiel items, are included in Appendix L. Section L.4 consists of Definitions of Common Elements Applicable to Space Programs.

F.3.2 Contract WBS Naming Conventions. The contract WBS shall use the appropriate Space System WBS elements and shall not include elements that are not within the scope of the contract. The contract element titles need not be identical to the Space WBS and may use the contractor names of hardware units and software CSCIs. Wherever possible, these titles should be descriptive of the element and not generic. For example, the following should not be used as complete titles: Other Costs, Digital Electronic Box 1, Bus Flight Software CSCI Application 2. As a specific example, the preferred title is “S-Band Helix Antenna”, as opposed to merely “Antenna” or “S-Band Helix”. Additionally, SEIT/PM and Support Equipment references should be replaced with terminology that accurately reflects its level and specific content, such as: “Space Vehicle Systems Engineering”. WBS elements that appear within multiple legs of the WBS should also indicate to which portion of the WBS it belongs. For example, a Receiver within an EHF Payload could be name “Wideband EHF Receiver”.

F.3.3 Application of (1…n), and (1…F) convention. This document uses a (1…n) after WBS element titles where the element may have multiple unique occurrences. When creating the WBS for a specific program or contract, the (1…n) shall be replaced with a specific name for the item. For example, where this WBS references Star Trackers (1…n) and the Attitude Control subsystem contains two types of Star Trackers, the contract WBS shall specifically identify them as separate Level 5 elements; such as Narrow Field Of View (NFOV) Star Tracker and Wide Field Of View (WFOV) Star Tracker. Fifth level elements without the (1…n) convention are primarily a collection of items that do not need to be extended to lower levels for reporting or other purposes. The contract dictionary definition for these elements shall be clear as to which Space System WBS element it belongs.

NOTE: The (1…F) convention is similar to the 1…n convention above, but is for functional breakout of specific GOPC systems. See Note 1 within F.4.3.3.1 for a detailed explanation.

F.3.4 Use of “Other” WBS Elements, The Other WBS elements at the system, subsystem, and element (product) levels are restricted to products that have not been envisioned or predicted in the other defined WBS elements. This element should only be used when all other elements have been thoroughly examined and do not fit the definition of the “other” product. Multiple elements, with appropriate titling, should be detailed down to the element level (Level 5) whenever possible. In addition the WBS dictionary should clearly define the elements. The program WBS index shall describe the element(s) and avoid any reference to “other”.

F.3.5 Use of the word “seperable”. Some of the definitions use the term “separable” with reference to hardware or software. Hardware and software are “separable” (from other hardware and software) if their costs are identifiable from each other.

F.3.6. Key Principles in Constructing a WBS. In the appendices of MIL-STD-881C, the WBS is defined to Level 3 of that structure and in some cases Level 4 or 5. In order to ensure consistency across all systems and developers, WBS elements in the appendices are extended to levels 4 and 5.

• 1) The reporting level of the WBS is typically at Level 3 except for those items considered high cost, high risk, or high technical interest. For those elements, extension of the WBS to lower levels is necessary to get needed visibility, but only for those elements. Not all WBS elements should be extended to the lowest level. In addition, for each system being defined only those WBS elements that define the system shall be used. The purpose of going below level 3 within the appendix is to ensure that the higher level elements include the proper lower level elements and when required to report at a lower level, those elements at level 4 or 5 are consistent across all systems and developers.

• 2) In each of the appendices, an element entitled “Other” is available to provide flexibility within the WBS for new or additional WBS elements that are not identified or defined in the Standard. These “other” elements would be used if, for example, a new subsystem or modified subsystem is defined and it does not currently appear in the appendices of MIL-STD-881C.

• 3) A key to WBS development is the principle that if you can associate the WBS element with the element it supports, it should be included within that element. This is called the 100% rule, which states the next level of decomposition of a WBS element (child level) must represent 100% of the work applicable to the next higher level (parent level). For example, the parent level WBS (radar system) has three child elements – transmitter, antenna, and receiver. If the program manager decides he/she wants more visibility into the transmitter subsystem and pulls it out of the radar system and makes it a level equal to the radar, it distorts the effort and resources that are required to complete that radar system because it assumes the transmitter is not included (i.e., a child element to the radar is now missing within the WBS structure).

• 4) In some cases, items cannot be specifically associated with the element they support. For example, software is a critical element of that transmitter subsystem. Under normal circumstances, software would be the child level to the parent level transmitter. However, depending on how software is developed, the software may include more functionality than just for the transmitter subsystem. It may include functionality for the receiver as well. In this case the software cannot be associated with the specific elements they support, due to an inability to determine the effort for each functionality developed. Therefore, it is appropriate to associate that software to the next highest level (radar system) of the WBS. It is still included as a part of the radar system at the child level, but we are not trying to allocate effort across multiple WBS elements where we are unable to determine what level of support each gets.

• 5) Intelligence (Intel) efforts (security, threat, mission data) are often considered late in the acquisition cycle, even after contract award. Identifying where Intel is needed reduces risk and affords a much better opportunity to manage cost, schedule, and performance. The WBS Standard portrays systems in a product-oriented WBS, identifying and considering potential intelligence information and costs using the existing Component cost estimating processes.

F.3.7 Numbering of the WBS. In each appendix, the work breakdown structure for that commodity has been numbered for reporting purposes only. The purpose for the numbering is to provide a consistent approach to identifying and managing the WBS across like systems regardless of vendor or service. The numbering system is numeric; however, several unique issues arise across appendices which require the numbering system to be modified to accommodate the anomalies.

F.3.7.1. “Other” WBS Elements. All appendices contain a WBS element titled as “Other” at the subsystem, element (product) levels that are restricted for products that have not been envisioned or predicted within the defined WBS elements in the Appendix. If it is determined that the “other” WBS is not needed, this element and assigned WBS number should be deleted and not used in the WBS. If it is determined that the “other” element is needed, then each element must be defined and the word “other” replaced by the newly defined WBS element using the assigned WBS number from the appropriate appendix. The newly defined element must be approved by the Government Program Manager and the representative contracting officer.

F.3.7.2 (1…n) WBS Element Definitions. Several appendices identify WBS elements with (1…n) or similar to denote that one or more of that type of item may be used. Where this structure occurs, the parent WBS (e.g., 1…n) shall be decomposed to the next level and then each child WBS use the appropriate WBS title for each element as well as the WBS numbering identification. For example, if a missile system has multiple propulsion subsystems, each Propulsion Subsystem (1…n) shall have a WBS name designation (for example, “Solid Rocket Motor”), and the element Propulsion Subsystem 1 would be at the child level of the parent WBS element (Propulsion Subsystem 1…n) as would Propulsion Subsystem 2 (for example, “Liquid Rocket Engine”), and so forth. Each WBS should be detailed down to the element’s lower level (as defined in the appendices) whenever possible, and assigned the next available WBS number in sequence according to the parent child relationship as shown below.

• 1.1.2. Propulsion Subsystem (1…n)
• 1.1.2.1. Solid Rocket Motor
• 1.1.2.2. Liquid Rocket Engine
• 1.1.2.3. Backup Rocket Motor

F.4 DEFINITIONS

F.4.1 Space System. The complex of equipment (Hardware/Software) and all of the resources associated with the design, development, production, integration, assembly, test, and operation of the entire Space System.

• Includes, for example:
• a. Space vehicle(s); ground operations and processing center(s); ground terminals; launch vehicle(s); and any mission equipment or other items necessary to provide an operational capability in space.
• b. Any efforts done within a development/acquisition contract, including such things as integrated logistic planning, space vehicle on-orbit checkout, calibration, and orbit raising.
• c. Program management, system engineering, integration and test, support equipment at all levels of indenture where they are necessary

• Excludes, for example:
• a. On-orbit operations beyond checkout and acceptance
• b. Ground operations and maintenance

F.4.2 Space Vehicle 1…n (Specify). A complete Space Vehicle in a multiple or dissimilar Space Vehicle configuration. This WBS element is intended for Space Vehicle(s) that are unmanned satellites orbiting the earth. It contains all of the resources associated with the design, development, production, integration, assembly, and test to include verification testing of each Space Vehicle as required.

• Includes, for example:
• a. The design, development, and production, integration, assembly, test, and checkout of complete elements (i.e., the prototype or operationally configured elements, which satisfy the requirements of their applicable specification, regardless of end use)
• b. Sub-elements to the Space Vehicle-Bus, Payload; Booster Adapter; Space Vehicle Storage; Launch Systems Integration; Launch Operations and Mission Operations Support (F.4.2.1-F.4.2.7)

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L section L.4.

F.4.2.1 Bus. The portion of the Space Vehicle that serves as a housing or platform for carrying Payloads and provides necessary support functions (power, thermal control, etc.). It also interfaces with the Launch Vehicle (F.4.7) via the Booster Adapter (F.4.2.3).

• Includes, for example:
• a. Structures and Mechanisms (S&M), Thermal Control (TCS), Electrical Power (EPS), Attitude Control (ACS), Propulsion (PS), Telemetry, Tracking, and Command (TT&C) subsystems; and Bus Flight Software
• b. All design, development, production, and assembly, test, and checkout efforts to provide the Bus as an entity or as subsystems for integration with other WBS Level 3 elements (i.e., Payload Equipment) hardware elements

NOTE 1: On more complicated Space Vehicles, there may be an integrated digital system (single electronic box or set of boxes) that performs processing functions for both the Bus and Payloads. In these cases it is acceptable to consider the Multi-Processor system as a single Payload or as part of a specific Payload. The Multi-Processor System may integrate functions normally included under ACS, TT&C, Communication and other Payloads. The relevant point is to keep the cost in a single element and not allocate over multiple WBS elements.

NOTE 2: For lower level Common Elements such as SEIT/PM, reference Appendix L, section L.4.

F.4.2.1.1 Structures and Mechanisms (SMS). This subsystem provides structural support, deployment and locking functions for the Space Vehicle.

• Includes, for example:
• a. Items such as structure, mechanisms, structures with integral (non-removable) thermal control, pyrotechnics
• b. Equipment compartments, trusses, frames and shells for carrying primary loads; and secondary structures for equipment support; structural assemblies for interfacing with the Booster Adapter and/or with the Launch Vehicle.
• c. All load carrying devices, such as Payload equipment panels that are provided to Payload equipment suppliers for supporting Payload equipment components
• d. Springs, cables, latches and other mechanisms and support structures that are not defined elsewhere within the WBS and are cost separable

• Excludes, for example:
• a. Mechanisms that are identified with specific elements they support, such as Solar Array Positioners and gimbals for antennas
• b. Booster adapters not integral with spacecraft structures
• c. Payload fairings that are included in the launch vehicle element
• d. Small equipment compartments or pallets that house Payload electronics, which are part of the Payload element
• e. Booms that are used to exclusively support Payload components or assemblies in the Payload element

NOTE 1: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.1.1 Structures. This collection of items provides structural support for all Bus and Payload components and assemblies. They include items such as equipment compartments (structural elements that protect from radiation, thermal, electromagnetic, and other effects; excluding single unit chassis integral to that unit); trusses, frames and shells for carrying primary loads; and secondary structures for equipment support. This element includes all load-carrying devices, such as Payload equipment panels that are provided to Payload Equipment suppliers for supporting Payload Equipment components. However, structural elements such as small equipment compartments or pallets that house Payload electronics and are provided as part of Payload equipment are excluded from this WBS element and included in the appropriate Payload equipment Structures element. Booms exclusively for supporting payload equipment components or assemblies are also included in payload structures.

F.4.2.1.1.2 Mechanisms and Pyrotechnics. The collection of items that deploy or lock Space Vehicle components, excluding Antenna and Solar Array mechanisms (to the extent that the Mechanisms are separable from the components they support). This element also includes items that provide reaction force to initiate release for separation or deployment. These devices include squibs and ordnance separation units. Pyrotechnic initiation electronics are normally included within the Electrical Power subsystem.

• Includes, for example:
• a. Hinges
• b. Springs
• c. Cables
• d. Latches
• e. Motors
• f. Separation bolts
• g. Squibs

• Excludes, for example:
• a. Antenna
• b. Optics
• c. Sensor
• d. Solar array mechanisms

F.4.2.1.1.3 SMS Other. This WBS element contains all the resources associated with unique Structures and Mechanisms subsystem hardware not included in WBS elements above.

F.4.2.1.2 Thermal Control (TCS). This subsystem maintains the temperatures of all Bus components, and those Payload suites without their own Thermal Control provisions, within acceptable limits.

• Includes, for example:
• a. Active and passive components such as Cryogenic Devices, Liquid Loops, Electric Coolers, multi- layer thermal insulation blankets (MLI), surface coatings (thermal paint), mirrors, thermal tape, heat pipes, heat sinks, insulation, conductive structures and materials, louvers, sun shields, Electric Coolers, Heaters, Thermisters, Thermostats, shutters, thermal conducting elements, and radiator panels/fins

NOTE 1: In cases where a Payload contains its own thermal control provisions, the Thermal Control components are included in the Payload WBS element.

NOTE 2: When a component or unit has integral (non-removable) thermal control provisions such as heat sinks, thermisters, or heaters then that item should be included within that component or unit. NOTE 3: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.2.1 Cryogenic Devices. This collection of items facilitates the control of operating temperatures of Bus components and those Payload suites without their own Thermal Control provisions by obtaining or operating at cryogenic (below 150 degrees centigrade) temperatures. Examples include cryocoolers and cryostats.

F.4.2.1.2.2 Liquid Loops. This collection of items compose a heat transfer system that helps control temperatures of Bus components, and those Payload suites without their own Thermal Control provisions. This system is usually comprised of fluid (gas or liquid) conduits (tubing), heat exchangers, and pumps.

F.4.2.1.2.3 Electric Coolers. This collection of items electrically reduces operating temperatures of Bus components, and those Payload suites without their own thermal control provisions.

• Includes, for example:
• a. Peltier devices
• b. Peltier diodes
• c. Peltier heat pumps
• d. Solid state refrigerators
• e. Thermoelectric coolers (tecs) or any electronics for controlling the coolers

F.4.2.1.2.4 Heaters, Thermisters and Thermostats. This collection of items actively controls heat loss by generating heat and controlling and monitoring temperatures. Thermisters and Thermostats are equivalent terms. Heater switching is included within the Electrical Power subsystem.

F.4.2.1.2.5 Passive Devices. This collection of items passively maintain the temperatures of all Bus components, and those Payload suites without their own Thermal Control provisions.

• Includes, for example:
• a. Radiator panels/fins
• b. Coatings
• c. Heat pipes
• d. Insulation
• e. Conductive structures
• f. Louvers and sun shields

F.4.2.1.2.6 TCS Other. This WBS element contains all the resources associated with unique Thermal Control subsystem hardware items not included in WBS elements above.

F.4.2.1.3 Electrical Power (EPS). This subsystem generates, converts, regulates, stores, distributes, and switches electrical energy to Bus and Payload components.

• Includes, for example:
• a. Electric power generation: solar array (to include substrates, solar cells, support structure), solar array positioner (to include drive assembly and drive electronics), radioisotope thermionic generator, other power sources
• b. Electric power conditioning and distribution: power control electronics (to include junction boxes and pyrotechnics/heater controls), power conversion electronics (to include inverters, converters and regulators), power dissipation devices (to include shunt resistor banks and dissipaters)
• c. Electric power storage: rechargeable batteries (to include cells, support structure and interconnects), charge control electronics
• d. Harnesses and cables

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.3.1 Solar Array. These elements generate power by converting solar energy into electricity with strings of solar cells. This WBS includes substrates, solar cells, interconnecting wiring, concentrators, cover-glass and supporting structure, which together form a solar panel. A Solar Array is made up of one or more solar panels (for example, a Solar Array wing) and mechanisms for deployment and latching.

F.4.2.1.3.2 Solar Array Positioner. This element orients the Solar Array to get the best sun incidence angle in order to maximize solar cell efficiency. This WBS includes both the drive assembly and any integral drive control electronics. Control Electronics for the positioner are typically located in the Attitude Control subsystem.

F.4.2.1.3.3 Radioisotope Thermionic Generator. This element converts heat into electricity via thermionic emission using nuclear-reactor or radioisotope energy sources. They are typically used for deep space missions where long mission life is required and when distances from the sun are large enough to render Solar Arrays ineffective.

F.4.2.1.3.4 Other Power Sources. These elements contain all the resources associated with electrical power generation hardware not included in WBS elements above. These elements include items such as non- rechargeable batteries and fuel cells (which convert chemical energy into electrical energy) and are typically used as backup power systems, using an energy source other than the Space Vehicle’s main power source.

F.4.2.1.3.5 Power Control, Switching and Distribution Electronics. This collection of items allow for power flow throughout the Space Vehicle. This WBS element includes power control, switching and distribution units; junction boxes; Pyrotechnics initiation, Heater switching, Propulsion Valve Drive Modules (PVDM), and battery switching units.

F.4.2.1.3.6 Power Conditioning, Conversion and Regulation. This collection of items condition, convert and regulate power throughout the Space Vehicle.

• Includes, for example:
• a. Inverters, converters, and regulators

F.4.2.1.3.7 Power Dissipation Devices. This collection of items dissipate power not used by the Space Vehicle electrical loads. This includes shunt resistor banks and other dissipaters.

F.4.2.1.3.8 Rechargeable Batteries. This collection of items stores and subsequently releases electrical energy. Batteries convert chemical energy into electrical energy during discharge and electrical energy into chemical energy during charge.

• Includes, for example:
• a. Battery cells
• b. Supporting structure (or packs)
• c. Interconnects
• d. Reconditioning equipment

F.4.2.1.3.9 Charge Control Electronics. This collection of items charges the batteries. This element controls the level to which a battery is charged or discharged. This includes battery charge assembly (BCA) and diodes.

F.4.2.1.3.10 Harnesses and Cables. This element is the collection of items used to route and provide electrical power and signals throughout the Space Vehicle. This is also commonly referred to as “wiring.”

• Includes, for example:
• a. Coaxial
• b. Fiber optic cables
• c. Installation hardware

• Excludes, for example:
• a. Harnessing within a Payload

F.4.2.1.3.11 EPS Other. This WBS element contains all the resources associated with unique Electrical Power subsystem hardware items not included in WBS elements above.

F.4.2.1.4 Attitude Control (ACS). This element determines and controls Space Vehicle orbital positions, attitudes, velocities and angular rates using onboard sensors and torque application devices. It may also send control signals to Propulsion subsystem components (e.g., Thrusters), the Electrical Power subsystem, Solar Array Positioners, and communication/ Payload positioner electronics.

• Includes, for example:
• a. Attitude determination: attitude reference (to include star tracker/sensors, earth (horizon) sensors, sun sensors, magnetometers), inertial reference (to include inertial reference units, rate gyros, accelerometers), bearing and power transfer assemblies (BAPTAs), and global position system (GPS) receivers
• b. Attitude control: gyro stabilization devices [to include reaction wheels, momentum wheels, control moment gyros, energy storage devices (flywheels)], magnetic control devices, spin control devices, control electronics

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.4.1 Star Tracker/Sensors 1…n (Specify). These elements are optical devices measuring the direction to one or more stars, typically using a photocell or solid-state Camera to observe the star(s).

F.4.2.1.4.2 Earth (Horizon) Sensors 1…n (Specify). These elements are optical instruments that detect light from the ‘limb’ of the Earth’s atmosphere, i.e., at the horizon. This can be a scanning or a staring instrument. Infrared is often used, which can function even on the dark side of the Earth. These elements provide orientation with respect to the Earth about two orthogonal axes.

F.4.2.1.4.3 Sun Sensors 1…n (Specify). These elements sense the direction to the Sun. This can be as simple as some solar cells and shades, or as complex as a steerable telescope, depending on mission requirements.

F.4.2.1.4.4 Magnetometers. These elements are used to measure the strength and/or direction of the Earth’s magnetic field. A commonly used device is a Three Axis Magnetometer (TAM), which helps the momentum management functions to generate signals to the Magnetic Torque Assembly (MTA). The TAM outputs three analog signals that are proportional to the components of the Earth’s magnetic field in the Magnetometer coordinate frame.

F.4.2.1.4.5 Global Positioning System (GPS) Receiver. This element calculates position by using timing signals sent by the constellation of GPS satellites. A GPS constellation is comprised of Medium Earth Orbit satellites that transmit precise microwave signals, that enable GPS Receivers to determine their location, speed, direction, and time. Excluded from this is the GPS Antenna and coax cabling that is included in the TT&C subsystem.

F.4.2.1.4.6 Inertial Reference Unit-IRU / Inertial Measurement Unit-IMU 1…n (Specify). These elements are a type of inertial sensor that uses only gyroscopes to determine a the Space Vehicle’s change in angular direction (referred to as “delta-theta” or Δθ) over a period of time. Unlike an Inertial Measurement Unit, Inertial Reference Units (IRUs) are generally not equipped with Accelerometers, which measure acceleration forces. IRUs are typically used for Attitude Control and navigation of vehicles with relatively constant acceleration rates, such as geosynchronous satellites and deep space probes.

F.4.2.1.4.7 Rate Gyros 1…n (Specify). These elements are sensors used to measure the angular rate measurements (3 degree axis – roll, pitch and yaw) of the Space Vehicle to help with maintaining the stabilization and pointing accuracy of the Space Vehicle.

F.4.2.1.4.8 Accelerometers 1…n (Specify). These elements are devices for measuring acceleration and gravity induced reaction forces. Single- and multi-axis models are available to detect magnitude and direction of the acceleration as a vector quantity. Accelerometers can be used to sense inclination, vibration, and shock.

F.4.2.1.4.9 Bearing and Power Transfer Assembly (BAPTA). This element is a mechanism that transmits electrical power and signals across rotating joints between the “spun” and “despun” sections of spin-stabilized space vehicles. They also control the orientation of the despun section about the spin axis in inertial space. A BAPTA usually consists of three main parts: (1) a bearing unit, (2) a drive unit and (3) a slip ring unit.

F.4.2.1.4.10 Attitude Control Wheels 1…n (Specify). These elements, also known as Gyro Stabilization Devices, provide angular stabilization of the Space Vehicle. These wheels control the attitude via the internal torques created by the electrically generated rotation of wheels. Usually, the wheels can be commanded to spin in either a clockwise or a counterclockwise direction, thereby creating the necessary angular momentum to counter the Space Vehicle’s momentum, in order to provide stability and pointing accuracy. Examples include: reaction wheels, control moment gyros (CMGs) and momentum wheels. Control electronics for wheel devices are included in the Control Electronics element (F.4.2.1.4.13) if they are separable from the wheel devices.

F.4.2.1.4.11 Magnetic Control Devices. These elements are electromagnets that apply torques to the Space Vehicle by interacting with the Earth’s magnetic field. They typically consist of a solid metal core, which is wound with two independent coils of copper wire, a case that protects them from physical damage and ultraviolet radiation, and mounting blocks and a connector.

F.4.2.1.4.12 Spin Control Devices. These elements dampen disturbance accelerations in spin-stabilized space vehicles. They include nutation and wobble dampers.

F.4.2.1.4.13 Control Electronics 1…n (Specify). These elements provide electrical interfaces between the Space Vehicle processor and sensors and effectors (reaction control wheels, BAPTAs, Magnetic Control Devices, Solar Array Positioners, Valves and Thrusters, etc.). This WBS element also includes computers or processors that are dedicated to Attitude Control subsystem functions. For effectors, the Control Electronics receive the input command from the Space Vehicle processor and convert it to the corresponding electrical interface stimulus, e.g., pulses, digital to analog converter (DAC), etc. for the effector. For sensors, the Control Electronics condition the telemetry signal (such as tach pulses, active analogs, etc.) to either an analog signal within the Analog-to-Digital Converter (ADC) range and/or convert to a corresponding digital output.

F.4.2.1.4.14 ACS Other. This WBS element contains all the resources associated with unique Attitude Control subsystem hardware items not included in WBS elements above.

F.4.2.1.5 Propulsion 1…n (Specify)1. This subsystem provides thrust for attitude control and orbit corrections as required to accomplish the specified mission. It may also provide thrust for orbit injection and changes.

• Includes, for example:
• a. Tanks, plumbing, thrusters, solid rocket motors, liquid propellant and pressurant

NOTE 1: A propulsion subsystem can either be liquid or electric; if the Space Vehicle contains both types, create two separate subsystems (1…n). Solid fuel Propulsion components, integral to the Space Vehicle, are booked with liquid Propulsion subsystem items.

NOTE 2: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.5.1 Tanks 1…n (Specify). These elements provide for storage of propellants and pressurants used in the Propulsion subsystem. Includes, for example, fuel tanks, oxidizer tanks, monopropellant tanks, helium (pressurant) tanks, xenon tanks, etc.

F.4.2.1.5.2 Plumbing. This collection of items provides for the Distribution and flow control of Propellants and Pressurants. Includes, for example, lines (tubing), fittings, regulators, filters, valves (squib, latch, fill/drain and check), manifolds, transducers, and installation hardware.

F.4.2.1.5.3 Thrusters 1…n (Specify). Thrusters provide the force to alter the attitude and velocity of a space vehicle. Includes, for example, Liquid Apogee Engine (LAE), liquid apogee motor, and thrusters of different LBFs (Pounds force), monopropellant, bipropellant, Xenon, and Hall Effect. This element also includes any Gimbal mechanism required for vector movement. This element excludes the electronics controlling the liquid thrusters, which are included in either the Attitude Control Subsystem or the TT&C Subsystem.

F.4.2.1.5.4 Solid Rocket Motors. These elements provide reaction force for the final Space Vehicle maneuver into orbit and for orbit changes. Nozzles may be fixed or steerable. Includes, for example, nozzle, casing, solid fuel propellant (grain), and igniter. Motors may be single use only, extinguished and re-ignited, or contain segments that are ignited by command. One specific example would be an Apogee Kick Motor (AKM).

F.4.2.1.5.5 Liquid Propellant and Pressurant. This collection of items provides for the propellant and pressurant (liquids and gasses) used to generate force (Delta V) or pressure. Includes, for example, bipropellant fuel and oxidizer, monopropellant fuel, helium pressurant, xenon (for electric propulsion) and other gasses/fuel used in the Propulsion subsystem.

F.4.2.1.5.6 Power Electronics. This element is a collection of items provide for the electric power used for an electric Propulsion subsystem. Includes, for example, power supplies and relay units. Excludes the power generation and distribution associated with the Electrical Power subsystem.

F.4.2.1.5.7 Propulsion Other. This element contains all the resources associated with unique Propulsion subsystem hardware items not included in WBS elements above.

F.4.2.1.6 Telemetry, Tracking, and Command (TT&C). This element performs functions such as: formatting and transmitting telemetry (typically on narrowband links); accepting, decoding, verifying, and storing uplink commands; and generating command and control signals for the Bus and Payload suites based on uplink commands and/or internally generated data. The TT&C subsystem may also: provide central processing functions, provide timing signals to the Bus and Payload suites; perform on-board attitude determination, ephemeris calculations and Attitude Control equipment control (if these are not performed by dedicated Attitude Control computers/electronic components); and perform Thruster control, Positioner control, Electrical Power monitoring/and control (if this is not performed by dedicated Electrical Power subsystem components).

• Includes, for example:
• a. Passive radio frequency (RF) components (such as antennas, passive signal flow control), other RF equipment (such as transmitters, receivers, transponder, modulators, demodulators, power amplifiers, traveling wave tube assembly, solid state power amplifiers, downconverters, and upconverters), processors (such as onboard computers [obcs]), solid state memory, decoders, command units, telemetry units, command sequencers, timing units, frequency generators, signal conditioners, data switches, and other electronics

• Excludes, for example:
• a. Pointing command and control equipment integral or dedicated to payload functions

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.1.6.1 Antennas. These elements are primarily used for TT&C specific functions. They receive RF signals for the command and control of the Space Vehicle and transmit Space Vehicle telemetry to the ground. These elements are typically omni-directional antennas including support structure and mechanisms, but can also be Feeds, Reflectors, and arrays. Antennas that are primarily used for mission objectives should be located within the Payload WBS. Includes the antenna for the GPS receiver.

F.4.2.1.6.2 Passive Signal Flow Control. This element is a collection of items that provide various passive RF signal flow and conditioning functionality within the TT&C subsystem. Includes, for example, RF plumbing, diplexers, triplexers, multiplexers, multicouplers, coaxial switches, RF switches, filters, waveguides, TT&C internal harnesses and cables, and other similar low-value items.

F.4.2.1.6.3 Transmitter/Receiver/Transceiver/Transponder 1…n (Specify). These electronics send and/or receive signals to and/or from TT&C antennas and separate them into analog or digital signals. TT&C transmitters typically convert digital telemetry signals into modulated RF signals. TT&C receivers receive RF signals and convert them to digital command signals. TT&C transceivers contain both a transmitter and a receiver. TT&C transponders relay RF signals.

F.4.2.1.6.4 Modulators/Demodulators/Modems. Modulators modify the amplitude, phase frequency of sinusoidal “carrier” signals to include information in the resultant (modulated) output signal. The input signals to modulators are usually digital signal streams, such as telemetry. Demodulators perform the inverse of modulators, separating digital information from carrier signals. Modems, which perform both operations, are also included in this WBS element.

F.4.2.1.6.5 Amplifiers. These elements are devices that change/increase the amplitude of a signal.

• Includes, for example:
• a. Solid state power amplifiers (SSPAs)
• b. Traveling wave tube amplifiers (TWTAs)
• c. Low noise amplifiers (LNAs)

F.4.2.1.6.6 Frequency Upconverter/Downconverter. These elements receive RF signals of one frequency and output at a different frequency. This is typically done by combining (mixing) the input signal with a sinusoidal signal from a local oscillator.

• Includes, for example:
• a. Frequency converters, upconverters and downconverters. A RF Upconverter is a device that takes an input of radio frequency energy of a specific frequency range and outputs it on a higher frequency. Likewise, Downconverters take an input frequency and reduce it to a lower output frequency.

F.4.2.1.6.7 Computers and Processors 1…n (Specify). These elements process data according to a list of computer software instructions (see Bus Flight Software) controlling the Bus subsystems and Payload functions not handled by Payload specific Processors. This includes, for example, Central Processing Units (CPUs) or Onboard Computers (OBCs). Computer and Processor memory may also be included within this WBS element.

• Includes, for example:
• a. Computers and processors that perform general spacecraft bus (and possibly payload) computing functions, such as command execution.

• Excludes, for example:
• a. Computers and processors dedicated to ACS attitude determination and control functions, or to payload functions, to the extent that those are separable from the TT&C computers and processors performing general functions

F.4.2.1.6.8 Command/Telemetry Units 1…n (Specify). These elements (digital) provide the engineering definitions used to configure and determine the health and status of the Space Vehicle. Typical Command units include: on/off, enable/disable, Flight Software (FSW) modes and states, unit configurations and operations, such as Reaction Control Wheel speed bias, voltage regulation percentage, Thruster valve firing durations, Solar Array angles, etc. Telemetry units are used in conjunction with calculation curves to convert raw data telemetry to engineering units, in order to determine the health and status of the Space Vehicle. Typical Telemetry Units include unit configuration and operational status: on/off, converter voltages, current draw, On-Board Fault Management (OBFM) configuration and status, FSW modes and states, attitude rates, RF signal strength, etc.

• Includes, for example:
• a. Command processing units
• b. Telemetry processing units
• c. Integrated command and telemetry (C&T) processing units (Many Space Vehicles employ both central command and telemetry units as well as remote units that interface with a limited number of payload or bus equipment)
• d. Central and remote C&T elements

F.4.2.1.6.9 Command Sensors 1…n (Specify). These elements are sensors (survivability, proximity, etc.) that detect events (e.g., nuclear, electromagnetic) or the presence of nearby objects without any physical contact for the safety of the Space Vehicle. A proximity sensor often emits an electromagnetic or electrostatic field, or a beam of electromagnetic radiation (infrared, for instance), and looks for changes in the field or return signal. Different proximity sensor targets demand different sensors. For example, a capacitive or photoelectric sensor might be suitable for a plastic target; an inductive proximity sensor requires a metal target.

F.4.2.1.6.10 Frequency and Timing. These elements provide stable timing and frequency reference signals (RF and digital) to other Space Vehicle electronics components including Payload components without their own frequency and timing capabilities. This WBS element includes frequency generators, oscillators and timing units.

F.4.2.1.6.11 Signal Conditioners. These elements alter (e.g., filter, eliminate noise, compress, amplify) analog signals to meet the requirements of the next processing stage. For example, the output of an electronic temperature sensor may be too low for an analog-to-digital converter (ADC) to process directly. In such a case, the signal conditioner will amplify the sensor output to bring the voltage level up to that required by the ADC.

F.4.2.1.6.12 Communications Security 1…n (Specify). Communications security (COMSEC) electronics encrypt digital telemetry data and decrypt digital command data. It may also encrypt low-volume payload digital data. Inputs to encryption devices usually come from telemetry units, while decryption inputs are usually the outputs of command receivers.

In some cases COMSEC circuit boards or chips may be packaged along with command and telemetry electronics. In these cases, the integrated electronic box is included in the Command and Telemetry Electronics WBS element. Similarly, if COMSEC equipment is integrated with TT&C transmitters or receivers, the electronics box is included in the Transmitters, Receivers and Transponders WBS element.

F.4.2.1.6.13 Data Storage, Handling and Interface 1…n (Specify). These elements carry, process, and/or store housekeeping, telemetry and mission data and may interface between Bus and/or Payload units. Includes, for example, interface units, data handling units, solid state recorders (SSRs), telemetry storage units (TSUs), tape recorders and disk recorders. These elements can include compression, and other interface functions, and digital multiplexers/demultiplexers. Excludes data storage units used primarily for storing payload data.

F.4.2.1.6.14 TT&C Other. This WBS element contains all the resources associated with unique TT&C subsystem hardware items not included in WBS elements above.

F.4.2.1.7 Bus Flight Software. This element includes all resources associated with bus flight software functions. Reference Appendix B for Software definitions.

The following CSCIs should be used when applicable (lower levels of these CSCIs may be used if more appropriate): Operating System and/or Boot Code, Command and Data Handling; Database; Health Maintenance and Status; Telemetry, Tracking and Control; Attitude Control; Electrical Power Management; and Thermal Control. The Bus Flight Application Software should be more than a single CSCI.

• Excludes, for example:
• a. ASIC and FPGA design, coding, and testing. These are included in the WBS elements containing the hardware in which ASICs and FPGAs are contained.
• b. Software development integral to recurring Bus hardware units (Level 5 items)

NOTE 1: Flight Software that is not segregable between the Bus and Payload is included within this WBS. Otherwise, software for performing Payload processing is included in the Payload Flight Software WBS element. Payload TT&C SW CSCIs that run on the bus processor is included in the Bus Flight Software WBS element. Space Framework software is also included here.

NOTE 2: For lower level Common elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

NOTE 3: For lower level software information, use the structure and definitions in Appendix B, Electronics Systems.

F.4.2.2 Payload 1…n (Specify). Payloads are the sets of hardware and software on a space vehicle that perform mission functions. Examples of space system mission functions are communications, remote sensing, surveillance and scientific exploration. A space vehicle may have multiple payloads, numbered here from 1 to N. All elements and components that are shared between distinct payloads can either be included within the first payload or a separate unique payload can be created for the shared units. A typical space vehicle configuration includes a communication subsystem (e.g., Payload 1) and optionally a complement of one or more sensing, surveillance, additional communication or exploration payloads. On a communication satellite each service or band should be considered a payload. A SV with a space to ground link, a crosslink, and a phased array system should have 3 distinct payloads. Common Items between them could be included in one of them or a 4th payload can be used to house the common HW, SW and or SEIT/PM. For a weather satellite that includes an imager, instrument B, and instrument C, and two communication services should have 5 distinct payloads.

• Includes, for example:
• a. All of the resources associated with the design, development, production, integration, assembly, and test to include verification testing of the Payload WBS equipment
• b. Payload subsystems: Structures and Mechanisms, Thermal Control, Electrical Power, Pointing Command and Control Interface, Antenna, Signal Electronics, Optical Assembly, Prime Mission Sensor, and Payload Flight Software
• c. Hardware components shared with the TT&C, such as Antennas and RF electronics, that are primarily used for mission objectives (see a. below)
• d. Command and Telemetry/Interface Units that are integral to the Payload suite (see b. below)

• Excludes, for example:
• a. Hardware components that are devoted primarily to TT&C functions (except the command and telemetry interfaces described in c. above)
• b. Command and Telemetry/Interface Units that interface with Payload equipment are included in the Bus TT&C subsystem unless they are integral to the Payload suite

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.1 Structures and Mechanisms. This subsystem is a summing element for payload structures and mechanisms. It includes structure, mechanisms, pyrotechnics devoted to payload functions (see Bus Structures and Mechanisms for further definition).

NOTE 1: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.1.1 Structures. This collection of items provides structural support for all Payload equipment, components and assemblies.

• Includes, for example:
• a. Structural support components
• b. Booms (excluding antenna booms)
• c. Frames, optical benches (that support the whole Payload)
• d. Equipment compartments or pallets that house Payload components and are integral to the Payload equipment.
• e. Optical benches may also be present within the Optical Assembly and Aft Optics elements

F.4.2.2.1.2 Mechanisms and Pyrotechnics. These elements are hardware end items, which stow, deploy, lock or support Payload components (excluding gimbals or positioners). This element also includes items that provide reaction force to initiate release for separation or deployment specific to the Payload. These elements are specific to the Payload.

• Excludes, for example:
• a. Payload gimbals and positioners

For a general definition, see Mechanisms and Pyrotechnics within the Bus Structures and Mechanisms subsystem.

F.4.2.2.1.3 Structures and Mechanisms Other. This element contains all the resources associated with unique Payload Structures and Mechanisms subsystem hardware items not included in elements above.

F.4.2.2.2 Thermal Control. This element uses Payload-specific thermal control equipment to maintain Payload component temperatures.

• Includes, for example:
• a. Active and passive components such as cryogenic devices,
• b. Liquid loops
• c. Electric coolers
• d. Multi-layer thermal insulation blankets (MLI)
• e. Surface coatings (thermal paint)
• f. Mirrors
• g. Thermal tape
• h. Heat pipes and sinks
• i. Insulation
• j. Conductive structures
• k. Louvers
• l. Sun shields
• m. Electric coolers
• n. Heaters
• o. Thermisters
• p. Thermostats
• q. Shutters
• r. Thermal conducting elements
• s. Radiator panels/fins

NOTE 1: In cases where Payload thermal control is an integral portion of Bus thermal control, the Payload thermal control equipment is included in the Bus Thermal Control subsystem.

NOTE 2: When a payload component or unit has integral (non-removable) thermal control provisions such as heat sinks, thermisters, or heaters then that item should be included within that component or unit.

NOTE 3: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.2.1 Cryogenic Devices. This collection of items facilitates the control of operating temperatures of Payload components by obtaining or operating at cryogenic (below minus 150 degrees centigrade) temperatures.

• Includes, for example:
• a. Cryocoolers and cryostats

F.4.2.2.2.2 Liquid Loops. This collection of items compose a heat transfer system that helps control temperatures within Payload components. This system is usually comprised of fluid (gas or liquid) conduits (tubing), heat exchangers, and pumps.

F.4.2.2.2.3 Electric Coolers. This collection of items electrically reduces operating temperatures of Payload components.

• Includes, for example:
• a. Peltier devices
• b. Peltier diodes
• c. Peltier heat pumps
• d. Solid state refrigerators
• e. Thermoelectric coolers (TECs)
• f. Electronics for controlling the coolers

F.4.2.2.2.4 Electric Heaters, Thermisters and Thermostats. This collection of items actively controls Payload heat loss by generating heat and controlling and monitoring temperatures. Thermisters and Thermostats are equivalent terms. Heater switching is included within the Payload Electrical Power or the Bus Electrical Power subsystems.

F.4.2.2.2.5 Passive Devices. This collection of items passively maintain the temperatures of all Payload components. Examples include radiator panels/fins, coatings, heat pipes, insulation, conductive Structures, and louvers.

F.4.2.2.2.6 Sun Shields. These elements, which are deployable, minimize thermal (and other energy) fluctuations by shielding the Payload from the sun. Additionally, sunshields can be employed to compensate for solar disturbances to pitch and yaw (solar torque balancing). Low-cost (passive) Payload sun shields may be included within Passive Devices.

F.4.2.2.2.7 Thermal Control Other. This element contains all the resources associated with unique Payload Thermal Control subsystem hardware items not included in elements above.

F.4.2.2.3 Electrical Power. This element generates, converts, regulates, stores and distributes electrical energy to the Payload. Included in the Payload Electrical Power subsystem are Power Supplies, Power Control Switching and Distribution, Power Conversion, and Harnesses and Cables. It excludes Electrical Power supply equipment in the Bus.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.3.1 Power Sources. This collection of items generates and sometimes stores the Electrical Power for Payload elements requiring a power alternative to the power generated in the Bus Electrical Power subsystem. Includes, for example, Solar Arrays, batteries, and capacitors.

F.4.2.2.3.2 Power Control Switching and Distribution Electronics. This element is a collection of electronics specific to the Payload that provides electrical power to Payload components.

• Includes, for example:
• a. Payload power control
• b. Switching and distribution electronics
• c. Payload junction boxes
• d. Payload pyrotechnics initiation electronics
• e. Payload heater switching electronics
• f. Payload battery switching electronics

F.4.2.2.3.3 Power Conditioning, Conversion and Regulation. These elements condition, convert and regulate power throughout the payload.

• Includes, for example:
• a. Inverters, converters, power supplies, and regulators

F.4.2.2.3.4 Harnesses and Cables. This collection of items is used to route and provide Electrical Power and signals throughout the Payload. For a general definition, see Harnesses and Cables within the Bus Electrical Power subsystem.

F.4.2.2.3.5 Electrical Power Other. This element contains all the resources associated with unique Payload Electrical Power subsystem hardware items not included in WBS elements above.

F.4.2.2.4 Pointing, Command, and Control Interface System. This element determines and controls payload positions and pointing orientations, independent of the space vehicle. This subsystem also provides processing primarily associated with payload. It is also the primary electronic interface between the payload and the spacecraft bus and/or other payloads. It may also send control signals to other payload equipment.

• Includes, for example:
• a. Computers and processors
• b. Command and telemetry electronics
• c. Control electronics
• d. Pointing sensors
• e. Payload positioners
• f. Data handling/switching

• Excludes, for example:
• a. Positioners dedicated to payload antennas
• b. Optical assemblies and sensors

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.4.1 Computers and Processors 1…n (Specify). These elements process payload data according to a list of computer software instructions (see Payload Flight Software) for the Payload subsystems. This excludes payload functions handled by Bus processors. This includes, for example, Central Processing Units (CPUs) or Onboard Computers (OBCs). Computer and Processor memory may also be included within this WBS element.

F.4.2.2.4.2 Command/Telemetry Elements 1…n (Specify). These elements (digital) provide the engineering definitions used to configure and determine the health and status of the Payload. For a general definition, see Command/Telemetry Units within the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.4.3 Control Electronics 1…n (Specify). These elements provide electrical interfaces between the Payload and/or Bus processor(s)/sensors and payload effectors. For a general definition, see Control Electronics within the Bus Attitude Control subsystem.

F.4.2.2.4.4 Pointing Sensors 1…n (Specify). These elements provide directional information for Payloads. Includes Star Trackers and Sun Sensors, inertial reference units and other sensors dedicated to payload pointing/positioning. For a general definition, see corresponding sensors within the Bus Attitude Control subsystem.

F.4.2.2.4.5 Payload Positioners 1…n (Specify). These elements position, point and/or move the entire payload. This excludes those positioning elements dedicated to payload antennas, optical assemblies and sensors, which are included within the corresponding WBS elements below.

F.4.2.2.4.6 Security, Encryption and Decryption Devices 1…n (Specify). These elements encrypt and/or decrypt Payload data. For a general definition, see Communications Security (COMSEC / Encryption and Decryption devices) within the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.4.7 Data Storage, Handling and Interface 1…n (Specify). These elements carry, process, and/or store housekeeping, telemetry and mission data and may interface with Payload units.

• Includes, for example:
• a. Interface units, data handling units
• b. Solid state recorders (SSRs)
• c. Telemetry storage units (TSUs)
• d. Tape recorders and disk recorders
• e. Compression, and other interface functions

• Excludes, for example:
• a. Data storage units used primarily for storing Bus data

F.4.2.2.4.8 Multifunctional Digital Electronic Boxes 1…n (Specify). These elements are unique digital electronic devices that may combine multiple functions identified above and therefore do not fit into a single element above and are specific to the Payload. These units may also include functions from other subsystems such as Multifunctional Signal Electronic Boxes (therefore these units can include Analog/RF devices also). These units are likely to contain ASICs, FPGA, or processors and may also run software.

• Includes, for example:
• a. Digital signal processors, A/D and D/A converters, Digital Channelizers
• b. Digital modems, routers
• c. Remote access servers

F.4.2.2.4.9 Pointing, Command, and Control Interface System Other. This WBS element contains all the resources associated with unique Pointing, Command, and Control Interface subsystem hardware items not included in elements above.

F.4.2.2.5 Payload Antenna 1…n (Specify). These units transmit and/or receive RF signals. These antennas are primarily used for mission data and may also carry TT&C data. It includes structure and mechanisms, feeds, reflectors, positioners, wiring and waveguides and, for phased array antennas, transmit/receive modules.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.5.1 Structures and Mechanisms. This element is a collection of items that provides structural support for Antenna equipment and components.

• Includes, for example:
• a. Antenna structural support components
• b. Booms
• c. Locks
• d. Small equipment compartments or pallets that house antenna electronics and are integral to the Payload Antenna

F.4.2.2.5.2 Antenna Positioners. These elements typically point entire antennas in a desired direction. Alternatively, antenna positioners might move a reflector or feed to point the antenna beam in the desired direction.

• Includes, for example:
• a. Positioner mechanism and its control electronics if integral with the mechanism
• b. Control electronics in separate enclosures are included in Payload Control Electronics above

F.4.2.2.5.3 Reflector 1…n (Specify). These elements focus received and/or transmitted electromagnetic waves (signals). The most common reflectors are parabolic reflectors, which focus a received signal into one point or direct a transmitted signal into a beam; flat reflectors that reflect the signal like a mirror and are often used as passive repeaters; and corner reflectors that reflect the incoming signal back in the direction it came from. A horn is an open-ended waveguide of increasing cross-sectional area, which feeds a reflector that forms a beam, or alternatively radiates directly (without a reflector).

• Includes, for example:
• a. Both primary and sub-reflectors

F.4.2.2.5.4 Feed 1…n (Specify). These elements receive and/or transmit signals. Functionally, they are usually located between a reflector and an amplifier, such as a high power amplifier (HPA), used for transmitting signals, or a low noise amplifier (LNA), used for receiving signals. A feed typically consists of a horn, spiral element or a set of dipoles and RF components (if they are not separable from the feed itself), such as orthomode transducers, polarizers, frequency diplexers and waveguide or coaxial cable connections. This element also includes complete antennas.

• Includes, for example:
• a. Horn
• b. Spiral
• c. Patch
• d. Dipole, and helix
• e. Anything that cannot be separated into components

F.4.2.2.5.5 Waveguide/Coax/Cabling. This element is a collection of items that route transmitted signals to the antenna feed or feed electronics. It also routes received signals to the first stage receiving electronics. Other signal and power routing, such as for antenna positioners, is also included in this element.

F.4.2.2.5.6 Transmit/Receive Modules. These elements provide power amplification of input signals for transmission, low noise amplification of received signals, both coupled to and received from the module’s radiating elements, phase shifting in the transmit and receive mode for beam steering, and variable gain setting for aperture weighting during reception. Phased array antennas are typically made up of arrays of transmit/receive modules, coupled to a common signal source or load, to produce a directional radiation pattern. In some cases transmit/receive modules are fully integrated assemblies in the form of “tiles” that can be laid side-by-side on support structures.

F.4.2.2.5.7 Antenna Other. This element contains all the resources associated with unique Payload Antenna subsystem Hardware not included in WBS elements above.

F.4.2.2.6 Payload Signal Electronics. This subsystem is a summing element for a wide range of Payload RF and analog signal processing electronics and RF plumbing.

• Includes, for example:
• a. Passive signal flow control
• b. Transmitters, receivers
• c. Transceivers
• d. Modulators
• e. Demodulators
• f. Multiplexers
• g. Demultiplexers
• h. Power amplifiers
• i. Frequency converters
• j. Frequency and timing units
• k. Signal conditioners

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.6.1 Passive Signal Flow Control. This element is a collection of items including a wide range of RF and other analog signal processing electronics and RF plumbing within the Payload.

• Includes, for example:
• a. Multicouplers, coaxial switches
• b. RF switches
• c. Filters
• d. Waveguides (excluding those in Antenna)
• e. Payload internal harnesses and cables
• f. Other similar low-value items

F.4.2.2.6.2 Transmitter/Receiver/Transceiver/Transponder 1…n (Specify). These elements are electronic devices that send and/or receive signals to and/or from Antennas and separate them into useful analog or digital signals. These elements are specific to the Payload. For a general definition, see Transmitters/Receivers/ Transceivers within the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.6.3 Modulators/Demodulators/Modems 1…n (Specify). These elements include modulators, demodulators and modems that are specific to the Payload. For a general definition, see TT&C Modulators and Demodulators in the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.6.4 Multiplexers/Demultiplexers. These elements allow efficient transmission and subsequent reception of multiple signals via a single signal. A multiplexer combines several input signals into one output signal containing several communication channels. A demultiplexer separates a single input signal that carries many channels into multiple output signals.

• Includes, for example:
• a. Only RF and analog multiplexers and demultiplexers

• Excludes, for example:
• a. Digital multiplexers/demultiplexers that are located in Data Storage Handling, and Interface

F.4.2.2.6.5 Amplifiers 1…n (Specify). These elements are devices that change/increase the amplitude of payload signals. This element includes amplifiers that are specific to the Payload. For a general definition, see TT&C Amplifiers in the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.6.6 Frequency Upconverter/Downconverter 1…n (Specify). These elements receive radio signals of one frequency and output at a different frequency. These elements are specific to the Payload. For a general definition, see Frequency Upconverters / Downconverters within the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.6.7 Frequency and Timing 1…n (Specify). These elements provide stable timing and frequency reference signals (RF and digital) to the other Payload electronics units.

• Includes, for example:
• a. Frequency generators
• b. Oscillators
• c. Timing units

F.4.2.2.6.8 Signal Conditioners 1…n (Specify). These elements alter (e.g., filter, eliminate noise, compress, amplify) analog signals to meet the requirements of the next processing stage. These elements are specific to the Payload. Excludes Power Amplifiers. For a general definition, see Signal Conditioners within the Bus Telemetry, Tracking, and Command subsystem.

F.4.2.2.6.9 Multifunctional Signal Electronic Boxes 1…n (Specify). These elements are unique analog electronic devices, which may combine multiple functions identified above and therefore do not fit into a single element above and are specific to the Payload.

• Excludes, for example:
• a. Units that contain Digital Electronics (See F.4.2.2.4.8 Multifunctional Digital Electronic Boxes )

F.4.2.2.6.10 Signal Electronics Other. This element contains all the resources associated with unique Payload Signal Electronics hardware items not included in WBS elements above.

F.4.2.2.7 Optical Assembly. Optical Assemblies (e.g., telescopes) have optical elements that collect and focus optical energy or create optical waveforms for transmission. They are often used to place images or optical patterns on focal plane sensors for detection, or for transmitting optical communication signals as in laser communications terminals.

• Includes, for example:
• a. Optical assembly structure and mechanisms
• b. Thermal control provisions
• c. Fore optics
• d. Aft optics
• e. Alignment sensors
• f. Positioners and calibration equipment

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.7.1 Structure/Outerbarrel/Cover. This equipment supports and stabilizes optical elements, sensors and other optical assembly equipment.

• Includes, for example:
• a. Enclosing structure (including tubes/outer barrel, tube doors, and associated integration, mounting, and interface hardware)
• b. Load-bearing structure (includes equipment compartment, equipment shelf, support tubes, mounts, struts, and associated integration, mounting, and interface hardware and secondary hardware if not separable)
• c. Secondary structure (including baffles), and integration, mounting, and interface hardware)
• d. Door actuators (includes control electronics if costs not separable); optical bench (supporting entire optical assembly)
• e. Optical-assembly specific thermal control elements (including thermostats, thermistors, thermal control electronics, heaters, insulation, and paints)
• f. Other structures and mechanisms

• Excludes, for example:
• a. Sun shields (which are in payload thermal control) if separable

F.4.2.2.7.2 Mirrors/Optics 1…n (Specify). These elements are principal light-gathering surfaces of a reflective (using mirrors) and refractive (using lenses) telescopes and related instruments. Primary Mirrors can be monolithic blocks of glass or other material, curved to exact shapes and coated with a reflective layer; or constructed from small segments of mirrors, merged (by physical contact or later by optics) into one large Primary Mirror. Primary Optics (also called objective) refers to the lens in a refractive telescope, camera or other optical instrument that receives the first light rays from the object being observed. A Secondary Mirror (or secondary) is a second light gathering and focusing surface in a Reflector telescope. Light gathered by the Primary Mirror is directed towards a focal point typically past the location of the secondary. The secondary directs the light either out a side opening of the tube (Newtonian Reflector) or back towards a focal point behind and through the Primary Mirror/Optics. Tertiary Optics is used to change the focal point to a convenient viewing angle or location. This element includes primary, secondary, tertiary mirror assemblies (assembly may include associated mounts, mount pads, and other frame).

F.4.2.2.7.3 Aft Optics Assembly. This element is a collection of items that provide additional focusing and manipulation of radiation from the tertiary optics before it enters the collection sensor. Optical splitters, prisms, filters and relay mirrors are typical aft optical elements. Optical benches supporting the aft optics and collection sensor are made of very thermally stable materials such as Invar or graphite epoxy composites. This optical bench is integral to the Aft Optics. This WBS element excludes collection sensors that are contained in Payload Sensors.

F.4.2.2.7.4 Alignment and Calibration. This element is a collection of items that compensate for the effects of launch shock and vibration, temperature changes, release of gravitational stress, age-related distortion and other changes to the optical assembly equipment alignment. These elements are specifically designed for and dedicated to the optics assembly.

• Includes, for example:
• a. Alignment positioners
• b. Actuators
• c. Sensors
• d. Integral electronics
• e. Internal cables
• f. Calibration light sources
• g. Optics dedicated to calibration
• h. Lasers used for alignment

F.4.2.2.7.5 Optical Assembly Other. This element contains all the resources associated with unique Optical Payload Assembly hardware items not included in WBS elements above.

F.4.2.2.8 Sensor. Payload sensors collect photonic, electromagnetic, and other energy and convert it into electrical signals. The most common sensors detect light in various spectrums (such as ultra-violet, visible, infrared, x-ray). Mission Sensors may include enclosures, focal planes, electronics, positioners, calibration equipment, and other sensors. Thermal control and optics equipment are also included if they are integral to the sensor (i.e., not separable).

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.8.1 Enclosure 1…n (Specify). These elements are a collection of items that are cabinets or housings to protect the critical elements of the sensor equipment from the environment. Enclosures protect against mechanical loads and vibration, stabilize sensor temperatures, provide electromagnetic interference (EMI) and RF interference (RFI) shielding for electronic components and prevent contamination. Focal planes and optics are typically protected by enclosures.

• Excludes, for example:
• a. Enclosures that are integral to the sensors

F.4.2.2.8.2 Focal Plane Array 1…n (Specify). Focal planes convert photonic radiation (visible, IR, etc.) into electronic pixels representing the image projected on a plane. Focal planes have image-sensing detectors arranged in arrays (typically rectangular) on sensor chip assemblies (SCAs). One or more SCAs comprise the total focal plane complement of detectors. A focal plane assembly includes SCAs, support structure, optical filters, wiring and thermal control devices such as cold fingers and thermal enclosures.

F.4.2.2.8.3 Sensor Positioners 1…n (Specify). These elements position, point and/or move the sensor. This excludes those positioning elements dedicated to complete payloads, antennas, and optical assemblies.

F.4.2.2.8.4 Sensor Electronics 1…n (Specify). These elements perform front-end signal conditioning/processing, signal analog-to-digital conversion, digital-to-analog conversion, focal plane excitation, command execution, telemetry feed-back, and other related electrical power, analog and digital functions. This element only includes electronics that are segregable from the sensor.

F.4.2.2.8.5 Alignment and Calibration 1…n (Specify). These elements are a collection of items that compensate sensors for the effects of launch shock and vibration, temperature change, release of gravitational stress, age-related and other changes to sensor equipment alignment. This alignment function may be accomplished with the use of an alignment sensor and positioners.

• Includes, for example:
• a. Black bodies
• b. Light sources
• c. RASNIKS
• d. Lamps

F.4.2.2.8.6 Magnetometer 1…n (Specify). These elements measure the magnitude and/or direction of the Earth’s magnetic field. Excludes Magnetometers used on the Bus for attitude control.

F.4.2.2.8.7 Spectrometer 1…n (Specify). These elements measure properties of light over a specific portion of the electromagnetic spectrum. They are typically used in spectroscopic analysis to identify materials. They usually separate the light signals into different frequencies, producing a dispersive or non-dispersive spectrum. A dispersive spectrometer is like a prism: it scatters light of different energies to different locations. A non-dispersive Spectrometer measures the energy directly.

F.4.2.2.8.8 Radiometer 1…n (Specify). These elements detect and measure the intensity of radiation. Radiometers can also be applied to detectors operating any wavelength in the electromagnetic spectrum. Radiometers can measure radiation from clouds, snow, ice, bodies of water, the Earth’s surface and the Sun.

F.4.2.2.8.9 Camera 1…n (Specify). These elements usually employ a sensor charge coupled device (CCD) or composite metal oxide semiconductor (CMOS) charge injection device (CID) focal planes to record images.

• Excludes, for example:
• a. Complex imaging payloads that are segregable into their major components (optical assembly, sensor, structure, etc.)

F.4.2.2.8.10 Sounder 1…n (Specify). These elements measure the vertical distribution of physical properties of the atmosphere such as pressure, temperature, wind speed and direction (thus deriving wind shear), liquid water content, ozone concentration, and pollution. Remote sensing soundings generally use passive infrared and microwave radiometers but some actively transmit a signal and use the returned signal to measure characteristics of the atmosphere.

F.4.2.2.8.11 Other Sensor Types 1…n (Specify). These elements are other types of sensors not listed above.

F.4.2.2.8.12 Mission Sensor Other. This element contains all the resources associated with unique Prime Mission Sensor subsystem hardware items not included in elements above.

F.4.2.2.9 Payload Flight Software. This element includes all resources associated with payload flight software functions. Reference Appendix B for Software definitions.

The payload flight software is segregated into logical products (CSCIs). The following CSCIs should be used when applicable (lower levels of these CSCIs may be used if more appropriate): Operating System and/or Boot Code, payload management, thermal control, payload processing, alignment, calibration, and payload control.

• Excludes, for example:
• a. ASIC and FPGA design, coding, and testing. These are included in the WBS elements containing the hardware in which ASICs and FPGAs are contained.
• b. Software development integral to recurring payload hardware elements (Level 5 items)

NOTE 1: Flight Software for performing Payload Processing is included here. Flight Software that cannot be separated between the Bus and the Payload equipment is included within the Bus Flight Software WBS element. Payload TT&C SW CSCIs that run on the bus processor is included in the Bus Flight Software WBS element.

NOTE 2: For lower level software information, use the structure and definitions in Appendix B, Electronics Systems.

NOTE 3: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.2.2.10 Payload Other. This element contains all the resources associated with unique Payload system hardware or software items not included in WBS elements above and not applicable within the provided Payload subsystems.

F.4.2.3 Booster Adapter. The Booster Adapter provides the mechanical and electrical interface between the Launch Vehicle’s uppermost stage and the Space Vehicle. It can be as simple as a snap ring device, but it is usually a more complex shell or frame structural assembly. This element is also called a payload adapter or payload attach fitting.

• Includes, for example:
• a. All of the material and effort associated with the design, development, production, integration, assembly, and test of the booster adapter
• b. Adapter structures, attachment and release devices, thermal control, instrumentation, and umbilical provisions
• c. Adapters located between space vehicles on a multi-vehicle launch that are segregable

• Excludes, for example:
• a. Booster adapters integral to bus structure
• b. Adapters included as part of the Launch Vehicle

F.4.2.4 Space Vehicle Storage. This element contains activities associated with storing Space Vehicles or portions of Space Vehicles. This includes preparation for storage, recovery from storage and post storage testing. The costs of holding portions of the space vehicle while waiting for the use of test facilities and/or equipment, or the completion of other portions of the Space Vehicle are also included. The storage period typically starts when production testing is complete and continues until the Space Vehicle is ready for shipping to the launch site.

• Includes, for example:
• a. Planning, preparation, movement, storage, maintenance, removal, refurbishment, and retesting of the Space Vehicle and/or its subsystems
• b. Costs for storage facility use and environmental control equipment
• c. Reinstallation of previously installed and tested components
• d. Shipping between storage and refurbishment sites, including any required shipping container/packing material (if the same shipping container is used during Launch Operations then the container falls within the F.4.2.6 Launch Operations element

• Excludes, for example:
• a. Final space vehicle assembly and test activities of previously unassembled and/or untested portions of the Space Vehicle
• b. Shipping to the launch site

F.4.2.5 Launch Systems Integration (LSI). LSI effort is primarily the engineering studies and analyses required to integrate a Space Vehicle with its Launch Vehicle and Orbital Transfer Vehicle, and insure the Space Vehicle is placed into orbit, as required. LSI effort is a coordinated activity between the Space Vehicle developer and the Launch Vehicle provider. The effort within this element is performed by Space Vehicle developer with support from the Launch Vehicle provider. The Launch Vehicle element also contains an associated LSI element.

• Includes, for example:
• a. Space Vehicle contractor studies, analysis, and tests supporting the integration of the Space Vehicle with the Launch Vehicle
• b. Review, verification, and validation of Launch Vehicle capability and compatibility with the Space Vehicle
• c. Definition, allocation, and decomposition of requirements to be placed on the Space Vehicle and Launch Vehicle, and the review, verification, and validation of these requirements
• d. Development and analyses of interface control documents with the Launch Vehicle to the Space Vehicle or Ground Segment
• e. Launch and range safety compliance, environmental test plans, and mission analysis.
• f. Space Vehicle contractor inputs to the Launch Vehicle provider to support the Launch Vehicle provider Launch System Integration activities
• g. Trajectory analyses, coupled dynamic loads analyses, induced environments analyses (acoustic, shock, vibration, thermal loads)

• Excludes, for example:
• a. Booster adapters that are in the Booster Adapter WBS
• b. Physical integration of the Launch Vehicle with the Space Vehicle
• c. Integration activities performed by the Launch Vehicle provider, which are included in the Launch Vehicle portion of the WBS

NOTE: The complete suite of Launch Systems Integration activities normally occurs only once with each Launch Vehicle type, but a smaller subset of these activities is repeated for each launch, primarily for Launch Vehicle trajectory and performance analyses. Other Launch Systems Integration activities may be repeated for subsequent launches due to mission changes that could impact the Launch Vehicle, Booster Adapter, Orbital Transfer Vehicle, or launch site facilities.

F.4.2.6 Launch Operations. Launch Operations are those efforts performed by the provider(s) of the Space Vehicle and Payload(s) to prepare for and support Space Vehicle launches, primarily at the launch base and, to a lesser degree, the Space Vehicle factory.

• Includes, for example:
• a. Satellite contractor effort associated with pre-launch planning and preparation to include: training; trailblazers; pathfinders; and documentation
• b. Preparation of the Space Vehicle for shipment to the launch site
• c. Shipping of the Space Vehicle to the launch site, including any required shipping container/packing material
• d. Payload (Space Vehicle) processing facility services
• e. Final assembly, test and checkout, fueling of the Space Vehicle at the launch site
• f. setup of support equipment
• g. Mating the Space Vehicle to the Launch Vehicle
• h. Engineering and maintenance support of the Space Vehicle at the launch site
• i. Pack-up and shipment of any support equipment back from the launch site
• j. Final reports Excludes, for example:
• a. Launch Systems Integration that is contained in its own Level 3 element

F.4.2.7 Mission Operations Support. This element encompasses the resources required for the deployment and operations of the Space Vehicle to achieve Initial Operational Capability (IOC).

• Includes, for example:
• a. telemetry (health and status) monitoring during launch, and separation;
• b. planning, commanding, monitoring, and reporting for orbital maneuvers, deployment, calibration, on- orbit engineering tests (as required), and initial operations;
• c. preparation, planning, and coordination of the hand-over to the long-term Mission Operations Team, which includes:

Orbit maneuvering Deployment Initial calibration On-orbit testing Monitoring of space vehicle health and status Fault detection Anomaly investigation and resolution Transition activity for long-term mission operations team

NOTE: The Mission Operations Support period typically begins pre-launch and ends when the Space Vehicle achieves Initial Operational Capability.

F.4.2.8 Space Vehicle Other. This element contains all the resources associated with the Space Vehicle not included in elements above.

F.4.3 Ground Operations and Processing Center (GOPC) 1…n (Specify). These elements command the Space Vehicle, and/or process and disseminate Bus and Payload data. Each GOPC provides one or more functions such as: command and control (CC), mission management (MM), mission data processing, mission data analysis, engineering development network, collection management, and infrastructure and framework (I&F).

• Includes, for example:
• a. All of the resources associated with its design, development, production, procurement, integration, assembly, and test of GOPC hardware and software
• b. Commercial Off-The-Shelf (COTS) hardware
• c. custom hardware
• d. Software (custom and COTS)

• Excludes, for example:
• a. GOPC buildings and other facilities. These are included within Facilities

NOTE 1: The intent of this (1…n) WBS structuring is to allow for separate unique GOPCs.

NOTE 2: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.3.1 Functions 1…F (Specify). This element provides for a functional breakout of the GOPC. The appropriate functional structure should be used. Functions may be combined or modified based on architecture and include their own storage and archival equipment and software. Common acquisition of equipment (e.g., Workstations) across functions can be collected within the Infrastructure and Framework (I&F) function. The I&F function can collect all the resources for that equipment/commodity, which reduces the need for allocations. The I&F function also includes any hardware or software that interfaces between multiple functions.

• Includes, for example:
• a. Mission Management (MM) – The Mission (Payload data) Management function receives tasking, generates and provides the system and mission plans, schedules, and timelines for the Space Vehicle(s) and GOPC(s).
• b. Command and Control (CC) – The Command and Control function decodes, demultiplexes, and decrypts space vehicle telemetry, generates and encrypts commands for transmission to the spacecraft, and processes tracking data to generate space vehicle ephemeris. This function provides the capability to prepare and output commands to, receive and process telemetry from the Space Vehicle, tracking, and other non-mission data. This function includes CC for the bus and may also include CC for the payload if not included in the Mission Data Processing function.
• c. Mission Data Processing – The Mission Data Processing function decodes, demultiplexes, decrypts and processes Mission data from the Payload(s) and may generate commands for Payload control if not included in CC function. Further data processing may take place external to this GOPC such as: a second GOPC, a national processing center, and/or on end-user equipment.
• d. Mission Data Analysis – The Mission Data Analysis function is responsible for examination of mission data (dissection, investigation, cross-referencing, etc.), from the Payload(s) on the Space Vehicle.
• e. Collection Management – The Collection Management function supports the end user by generating requests for tasking and subsequently tracking the fulfillment of each request. This function may also receive and analyze processed mission data and other external information. It could include the collection of tasking for multiple Space Systems, which subsequently forwards tasking to the Mission Management function.
• f. Infrastructure and Framework (I&F) – The Infrastructure and Framework function is responsible for the interchange or transfer of wideband data, narrowband data, command and control, telemetry, and other support data between functions internally within the GOPC (e.g., between the Mission Data Processing and Mission Data Analysis functions). It also can include hardware and/or software that are common to multiple functions, the engineering development or administrative networks, or required to interface to other GOPCs (other programs) at the same Ground Site. This function is also responsible for encryption and external transmission of data from the GOPC.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.3.1.1 COTS Hardware. This subsystem covers all commercial off-the-shelf (COTS) hardware items required to implement the intended function(s) of the GOPC.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.3.1.1.1 Workstations 1…n (Specify). These elements are computers often optimized for displaying and manipulating complex data such as engineering simulation, animation, image rendering, and mathematical plots. For further definition, see Workstations within the Ground Terminal Monitor and Control Hardware subsystem.

F.4.3.1.1.2 Servers 1…n (Specify). These elements are computers dedicated to providing one or more services over a computer network. For further definition, see Servers within the Ground Terminal Monitor and Control Hardware subsystem. This WBS element includes, for example, super-computers, mainframes, and mini- computers.

F.4.3.1.1.3 Storage and Archive 1…n (Specify). These elements store housekeeping, telemetry and mission data for processing and dissemination by other GOPC equipment.

• Includes, for example:
• a. Magnetic tape
• b. Magnetic disks
• c. Optical disks
• d. High density digital recorders (HDDR)
• e. Longitudinal recorders
• f. Helical recorders (video-cassette tapes)
• g. Direct archiving
• h. Reconfigurable frame recorders (RFR)
• i. Redundant array of independent discs (RAID)
• j. Network-Attached Storage (NAS)
• k. Storage Area Network (SAN)
• l. Tape/optical libraries or juke boxes
• m. RAM disks (solid state memory)

• Excludes, for example:
• a. Storage devices integral to Workstation elements

F.4.3.1.1.4 Network Equipment. This element is a collection of items that facilitate the use of a computer network.

• Includes, for example:
• a. Routers
• b. Switches
• c. Hubs
• d. Gateways
• e. Access points
• f. Network interface cards
• g. Network bridges
• h. Modems
• i. ISDN adapters
• j. Firewalls and other related hardware

F.4.3.1.1.5 Interface Equipment. These elements enable the recovery or creation of digital data from other formats (e.g., RF to digital, serial to parallel, fiber optic to RJ11) or to convert digital information into other formats for interfacing with other Ground equipment.

• Excludes, for example:
• a. Network equipment (including Modems)

F.4.3.1.1.6 Security Encryption/Decryption 1…n (Specify). These elements encrypt and/or decrypt data. For a general definition, see Communications Security (COMSEC / Encryption and Decryption devices) within the Bus Telemetry, Tracking, and Command subsystem.

F.4.3.1.1.7 Data Processing 1…n (Specify). These elements are COTS equipment that perform specialized data processing functions; typically using ASIC or FPGA technologies. Note that the resources required to develop and produce custom ASICs or to program an included FPGA is under Custom Hardware below.

• Excludes, for example:
• a. Workstations and servers that perform data processing functions

F.4.3.1.1.8 COTS Hardware Other. These elements contain all the resources associated with unique GOPC COTS Hardware subsystem hardware not included in elements above.

F.4.3.1.1.9 Pre-Ops Maintenance 1…n (Specify). These elements contain all the resources related to the pre-operations (Pre-Ops) maintenance of GOPC COTS Hardware subsystem equipment. This function begins with the acceptance of the COTS Hardware and ends with the start of Operations.

F.4.3.1.2 Custom Hardware. This element covers all custom (non-COTS) hardware items required to implement the intended function(s) of the GOPC. This WBS element contains all the resources associated with the design, development, production, procurement, assembly, and test of GOPC custom equipment. Includes the resources required to develop and produce custom ASICs or to program FPGAs (including those inserted into COTS hardware).

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.3.1.2.1 Custom Hardware Configured Item 1…n (Specify). These elements are custom hardware devices that perform unique or specific GOPC functions.

F.4.3.1.2.2 Pre-Ops Maintenance 1…n (Specify). These elements contain all the resources related to the pre-operations (Pre-Ops) maintenance of GOPC Custom Hardware subsystem equipment. This function begins with the acceptance of the Custom Hardware and ends with the start of Operations.

F.4.3.1.3 GOPC Software. This element includes all resources associated with a GOPC software function as listed in F.4.3.1 Functions. Reference Appendix B for Software definitions.

This element includes all resources associated with a GOPC software configuration item.

• Includes, for example:
• a. Pre-Ops Maintenance 1…n (Specify) that contains all the resources related to the pre-operations (Pre-Ops) maintenance of GOPC software. This function begins with the acceptance of the software and ends with the start of Operations
• Excludes, for example:
• a. ASIC and FPGA design, coding, and testing. These are included in the WBS elements containing the hardware in which ASICs and FPGAs are contained.
• b. Software development integral to recurring GOPC hardware elements (Level 5 items)

NOTE 1: For lower level software information, use the structure and definitions in Appendix B, Electronics Systems. NOTE 2: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.3.1.4 Pre-Operations Mission Support. This element includes all the resources required for the operation of the GOPC prior to turn-over.

• Includes, for example:
• a. On-orbit testing
• b. Routine monitoring of Space Vehicle equipment health and status
• c. Fault detection
• d. Anomaly investigation and resolution. (The Mission Support period typically begins after installation and a specified time prior to launch and ends when the Space Vehicle achieves initial operational capability.)

F.4.4 Ground Terminal/Gateway (GT) 1…n (Specify). These elements receive, demodulate, and condition telemetry, tracking, command, and mission (Payload) data. In addition, this subsystem generates the radio frequency (RF) uplink, accepts tracking and command signals, and modulates them onto the RF uplink.

• Includes, for example:
• a. Resources associated with the design, development, production, procurement, assembly, test, and site activation of the Ground Terminal (GT)
• b. Antenna
• c. RF electronics
• d. Timing subsystem equipment
• e. Baseband/network equipment
• f. Monitor and control hardware
• g. Ground terminal software

• Excludes, for example:
• a. Ground terminal buildings and other facilities. These are included within facilities above.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.1 Antenna 1…n (Specify). These elements transmit and/or receive RF signals that carry TT&C and/or mission data.

• Includes, for example:
• a. Pedestals
• b. Radomes
• c. Other structures
• d. Mechanisms
• e. Apertures
• f. Feeds
• g. Waveguides/coax/cabling

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.1.1 Pedestal. This element is the structure that supports and positions the Antenna Aperture in both azimuth and elevation. It also may serve as a housing or enclosure for other Antenna equipment.

• Includes, for example:
• a. Structure
• b. Gimbals
• c. Support

F.4.4.1.2 Radome. This element protects the Antenna from weather hazards (e.g., wind, rain, sand, ultraviolet (UV) light, ice, etc.). The material used in building the Radome allows for unattenuated electromagnetic signals. Radomes can be constructed in several shapes (spherical, geodesic, planar, etc.) using various materials (fiberglass, polytetrafluoroethylene (PTFE) coated fabric, etc.).

F.4.4.1.3 Other Structure and Mechanisms. This element is a collection of items that include equipment compartments, racks, or pallets that house Antenna related electronics, and other structural or mechanical elements not integral to the other Antenna equipment.

• Excludes, for example:
• a. Parts integral to the Pedestal (e.g., pointing gimbals)

F.4.4.1.4 Aperture. This element determines the aperture (effective area of radiation/energy absorption/generation) of the Antenna. This can be as simple as a reflector or a complex phased-array. In most cases a parabolic reflector with an associated Feed (see below) is used.

F.4.4.1.5 Feed 1…n (Specify). These elements receive and/or transmit signals. Feed refers to the components functionally between a reflector and an amplifier. A feed may consist of a horn, spiral element or a set of dipoles; an orthomode transducer, a polarizer, a frequency diplexer and a waveguide or coaxial cable connection.

F.4.4.1.6 Waveguide/Coax/Cabling. This collection of items routes transmitted signals to the antenna feed or feed electronics. It also routes received signals to the first stage receiving electronics. Other signal and power routing, such as to the Pedestal, is also included in this element.

F.4.4.1.7 Antenna Other. This element contains all the resources associated with unique Ground Antenna subsystem hardware items not included in elements above.

F.4.4.2 Optical Communication Assembly 1…n (Specify). An Optical Communication Assembly (e.g., telescope) has optical elements that collect and focus optical energy or that create optical waveforms for transmission. It is used for transmitting and receiving optical communication signals as in laser communications terminals.

• Includes, for example:
• a. Optical assembly structure and mechanisms
• b. Thermal control provisions
• c. Fore optics
• d. Aft optics
• e. Alignment sensors
• f. Positioners
• g. Calibration equipment

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.2.1 Structure/Outerbarrel/Cover. This equipment supports and stabilizes optical elements, sensors and other optical assembly equipment.

• Includes, for example:
• a. Enclosing structure (including tubes/outer barrel, tube doors, and associated integration, mounting, and interface hardware)
• b. Load-bearing structure (includes equipment compartment, equipment shelf, support tubes, mounts, struts, and associated integration, mounting, and interface hardware and secondary hardware if not separable)
• c. Secondary structure (including baffles), and integration, mounting, and interface hardware)
• d. Door actuators (includes control electronics if costs not separable)
• e. Optical-assembly specific thermal control elements (including thermostats, thermistors, thermal control electronics, heaters, insulation, and paints)
• f. Other structures and mechanisms

F.4.4.2.2 Mirror/Optics 1…n (Specify). These elements are principal light-gathering surfaces of a reflective (using mirrors) and refractive (using lenses) telescopes and related instruments. Primary Mirrors can be monolithic blocks of glass or other material, curved to exact shapes and coated with a reflective layer; or constructed from small segments of mirrors, merged (by physical contact or later by optics) into one large Primary Mirror. Primary Optics (also called objective) refers to the lens in a refractive telescope, or other optical instrument that receives the first light rays from the object being observed. A Secondary Mirror (or secondary) is a second light gathering and focusing surface in a Reflector telescope. Light gathered by the Primary Mirror is directed towards a focal point typically past the location of the secondary. The secondary directs the light either out a side opening of the tube (Newtonian Reflector) or back towards a focal point behind and through the Primary Mirror/Optics. Tertiary Optics are used to change the focal point to a convenient viewing angle or location.

• Includes, for example:
• a. Primary, secondary, tertiary mirror assemblies (assembly may include associated mounts, mount pads, and other frame)

F.4.4.2.3 Aft Optics and Bench. This collection of items provides additional focusing and manipulation of radiation from the tertiary optics before it enters the collection sensor. Optical splitters, shutters, prisms, filters and relay mirrors are typical aft optical elements. Optical benches usually support the aft optics and collection sensor and are made of very thermally stable materials such as Invar or graphite epoxy composites. This optical bench is integral to the Aft Optics.

F. 4.4.2.4 Alignment Sensors/Calibration. This collection of items compensates for the effects of vibration, temperature changes, age-related distortion and other changes to the optical assembly equipment alignment. These elements are specifically designed for and dedicated to the optics assembly.

• Includes, for example:
• a. Alignment positioners
• b. Actuators
• c. Sensors
• d. Integral electronics
• e. Internal cables
• f. Calibration light sources
• g. Optics dedicated to calibration
• h. Lasers used for alignment

F. 4.4.2.5 Optical Assembly Other. This element contains all the resources associated with unique Optical Communication Assembly hardware items not included in WBS elements above.

F.4.4.3 RF Electronics Band 1…n (Specify). These elements are a summing element for a wide range of Ground Terminal RF and analog signal processing electronics and RF plumbing.

• Includes, for example:
• a. Passive signal flow control
• b. Transmitters, receivers
• c. Transceivers
• d. Modulators
• e. Demodulators
• f. Multiplexers
• g. Demultiplexers
• h. Power amplifiers
• i. Frequency converters
• j. Signal conditioners
• k. Focal-plane arrays for optical communications

NOTE 1: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.3.1 Passive Signal Flow Control. This collection of items includes a wide range of RF and other analog signal processing electronics and RF plumbing within the Ground Terminal.

• Includes, for example:
• a. Multicouplers
• b. Coaxial switches
• c. RF switches
• d. Filters
• e. Waveguides (excluding those in antenna)
• f. Ground terminal interconnecting harnesses and cables
• g. Other similar low-value items

F.4.4.3.2 Transmitter/Receiver/Transceiver/Transponder 1…n (Specify). These elements are electronic devices that send and/or receive signals to and/or from Antennas and separate them into useful analog or digital signals. For a general definition, see Transmitters/Receivers/ Transceivers within the Bus Telemetry, Tracking, and Command subsystem.

F.4.4.3.3 Modulators/Demodulators/Modems 1…n (Specify). Modulators modify the amplitude and phase the frequency of sinusoidal “carrier” signals to include information in the resultant (modulated) output signal. The input signals to Modulators are usually digital signal streams. Demodulators perform the inverse of modulators, separating digital information from carrier signals. Modems, which perform both operations, are also included in this element.

F.4.4.3.4 Multiplexers/Demultiplexers 1…n (Specify). These elements allow efficient transmission and subsequent reception of multiple signals via a single signal. A multiplexer combines several input signals into one output signal containing several communication channels. A demultiplexer separates a single input signal that carries many channels into multiple output signals. This element includes only RF and analog multiplexers and demultiplexers.

F.4.4.3.5 Power Amplifiers 1…n (Specify). These elements are devices that change/increase the amplitude of signals. Includes, for example, solid state power amplifiers (SSPAs), traveling wave tube amplifiers (TWTAs), and low noise amplifiers (LNAs), and optical power amplifiers.

F.4.4.3.6 Frequency Upconverter/Downconverter 1…n (Specify). These elements receive radio signals of one frequency and output at a different frequency. For a general definition, see Frequency Upconverters / Downconverters within the Bus Telemetry, Tracking, and Command subsystem.

F.4.4.3.7 Signal Conditioners. These elements alter (e.g., filter, eliminate noise, compress, amplify) analog signals to meet the requirements of the next processing stage. Excludes Power Amplifiers. For a general definition, see Signal Conditioners within the Bus Telemetry, Tracking, and Command subsystem.

F.4.4.3.8 Signal Electronic Boxes 1…n (Specify). These elements are RF electronic devices that may combine multiple functions identified above and therefore do not fit into a single element above.

F. 4.4.3.9 Focal Plane Array 1…n (Specify). Focal planes convert photonic radiation (visible, IR, etc.) into electronic pixels representing the image projected on a plane. Focal planes have image sensing detectors arranged in arrays (typically rectangular) on sensor chip assemblies (SCAs). One or more SCAs comprise the total focal plane complement of detectors. A focal plane assembly includes SCAs, support structure, optical filters, wiring and thermal control devices such as cold fingers and thermal enclosures.

F.4.4.3.10 RF Electronics Other. This element contains all the resources associated with unique Ground Terminal RF Electronics subsystem hardware items not included in WBS elements above.

F.4.4.4 Timing. The subsystem generates and distributes accurate and stable timing and frequency references.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.4.1 Receiver. This element calculates position by using timing signals sent by the constellation of GPS satellites (or other timing sources).

F.4.4.4.2 Antenna 1…n (Specify). These elements receive RF signals for the Receiver. Most current systems use GPS (L-band), while in some systems the signals could be WWV (HF-band) or other source.

F.4.4.4.3 Frequency and Timing Generators. These elements provide stable timing and frequency reference signals (RF and digital) to the other electronics elements.

• Includes, for example:
• a. Frequency generators
• b. Oscillators
• c. Timing units

F.4.4.4.4 Amplifier and Distribution 1…n (Specify). These elements increase the frequency signal received from the Antenna and optionally distributes the frequency to several receivers.

• Includes, for example:
• a. Any cabling between antennas and receivers

F.4.4.4.5 Timing Other. This element contains all the resources associated with unique Timing subsystem hardware items not included in WBS elements above.

F.4.4.5 Baseband-Network. This element receives RF signals from the RF Electronics subsystem, converts them into a digital (or baseband signal) format, and subsequently interfaces with the Terrestrial Communications element. It also receives digital (or baseband signal) information from the Terrestrial Communication element, converts it to the proper RF signal interfacing with the RF electronics.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.5.1 Switches/Hubs and Routers. These elements provide junctions for digital equipment and route and forward the information to other electronic equipment.

F.4.4.5.2 Network Interface and Other Hardware. These elements interconnect, interface, and can house other Baseband-Network equipment. These elements may also interface with the network or communications hardware within a GOPC(s) or the External Network. Includes, for example, networking hardware, cables, racks, etc.

F.4.4.5.3 Modems. These elements convert digital information into the baseband RF signal or the baseband signal into digital format, depending on the direction of information flow.

F.4.4.5.4 Security/Encryption and Decryption Devices 1…n (Specify). These elements encrypt and/or decrypt Ground data. For a general definition, see Communications Security (COMSEC / Encryption and Decryption devices) within the Bus Telemetry, Tracking, and Command subsystem.

F.4.4.5.5 Baseband-Network Electronic Boxes 1…n (Specify). These elements are electronic devices that may combine multiple functions identified above and therefore do not fit into a single element above.

F.4.4.5.6 Baseband-Network Other. This element contains all the resources associated with unique Ground Terminal Baseband-Network subsystem hardware or software items not included in WBS elements above.

F.4.4.6 Monitor and Control Hardware. This element configures (e.g., power, antenna position, frequency) the station for communications to the Space Vehicle (for a satellite pass) and monitors (usually autonomous) other Ground Terminal subsystem equipment. In addition, it can provide monitoring, health status and commanding of the Space Vehicle as a back-up to GOPC(s).

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.4.6.1 Workstations 1…n (Specify). These elements are computers often optimized for displaying and manipulating complex data such as engineering simulation, animation, image rendering, and mathematical plots. They can support multiple displays. These elements are intended for use by one person at a time and are commonly connected to each other through a local area network via a Server.

• Includes, for example:
• a. Workstations
• b. Desktop and laptop computers
• c. Displays (monitors)
• d. Keyboards, mice, cables and software bought as part of the workstation

F.4.4.6.2 Servers 1…n (Specify). These elements are computers dedicated to providing processing services over a computer network. These services are furnished by specialized server applications, which are computer programs designed to handle multiple concurrent requests.

• Includes, for example:
• a. Application servers

F.4.4.6.3 Hardware Configured Item 1…n (Specify). These elements are hardware devices that perform unique or specific Ground Terminal, Monitor and Control functions.

• Excludes, for example:
• a. Workstations and servers

F.4.4.7 GT Software. This element includes all resources associated with GT software functions.

• Excludes, for example:
• a. ASIC and FPGA design, coding, and testing. These are included in the WBS elements containing the hardware in which ASICs and FPGAs are contained.
• b. Software development integral to recurring GT hardware units (Level 4 items)

NOTE 1: For lower level software information, use the structure and definitions in Appendix B, Electronic Systems. NOTE 2: For lower level Common Elements (e.g., SEIT/PM), reference Appendix L, section L.4.

F.4.4.8 Pre-Operations Maintenance 1…n (Specify). These elements contain all the resources related to the pre-operations (Pre-Ops) maintenance (hardware repair and software updates) of Ground Terminal equipment and software. This function begins with the acceptance of the Ground Terminal element and ends with the start of Operations.

F.4.4.9 Pre-Operations Mission Support. This element includes all the resources required for the operation of the Ground Terminal prior to turn-over.

• Includes, for example:
• a. On-orbit testing; routine monitoring of Space Vehicle equipment health and status
• b. Fault detection
• c. Anomaly investigation and resolution. (The Mission Support period typically begins after installation and a specified time prior to launch and ends when the Space Vehicle achieves initial operational capability.)

F.4.5 External Network (T-COMM). This element contains all the resources associated to design, develop, produce, procure, lease, assemble, and test external communication. External communication refers to hardware (equipment, lines or circuits) and software effort required for a system that moves data along external communication paths between required points.

• Includes, for example:
• a. Leased and owned transmissions methods transmitted through analog, digital, electronic, optical, or other methods and can be via terrestrial, undersea, or space

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.5.1 Leased Circuits. This element is associated with the leased transmission circuits.

F.4.5.1.1. Leased Circuit 1…n (Specify). These elements include all the resources required for each point- to-point leased circuit.

F.4.5.2 Purchased Circuits. This element is associated with the purchased transmission circuits.

F.4.5.2.1 Purchased Circuit 1…n (Specify). These elements include all the resources required for each point-to-point purchased circuit.

F.4.5.2.2 Pre-Ops Maintenance 1…n (Specify). These elements contain all the resources related to the pre-operations (Pre-Ops) maintenance of Purchased Circuit equipment. This function begins with the acceptance of the circuit and ends with the start of Operations.

F.4.6 User Equipment. This element (hardware/software) pertains to end-user equipment purchased or built as part of the Space System acquisition. User equipment includes, for example, satellite phones, field terminals (mobile or fixed), satellite modems, and hand-held GPS receivers.

For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.6.1 Equipment 1…n (Specify). These elements are a collection of items for a complete delivered unit of unique User Equipment.

F.4.6.1.1 Hardware Configured Item 1…n (Specify). These elements are the unique configuration- controlled portions or sub-units whose totality composes a completed piece of User Equipment.

F.4.6.1.2 Equipment Software (Specify). This element includes all resources associated with a single user equipment software configuration item.

NOTE: For lower level software information, use the structure and definitions in Appendix B, Electronics Systems.

F.4.6.2 Pre-Ops Maintenance 1…n (Specify). These elements contain all the resources related to the pre- operations (Pre-Ops) maintenance of User Equipment. This function begins with the acceptance of the User Equipment and ends with the start of Operations.

F.4.7 Facilities 1…n (Specify). These elements encompasses all the physical infrastructure required to access, house and support Ground Terminal, GOPC, and External network equipment and personnel.

• Includes, for example:
• a. All of the resources associated with the design, development, construction, integration, landscaping, and fitting of the Facilities WBS entities
• b. Facilities subsystems: Site Preparation, Landscape, Buildings, Equipment and Building Fit Out, Pre- Ops Maintenance, and Mission Support

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.7.1 Site Preparation. This subsystem includes the Grading (Land Preparation), Roads, Pads, Walls, Fencing, Utilities and subsystem other related costs needed to house, service and operate a Space System Ground site(s).

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.7.1.1 Graded Land. This item comprises the acquisition and the effort (land preparation) and resources necessary for ensuring a level (or possibly sloped to specific degree) base for a construction work such as: Pads or other foundations; or the base course for Roads or railways.

F.4.7.1.2 Roads. This element provides access to the Ground Segment buildings and equipment and encompasses all the effort and resources for road construction including excavation, removal of material, filling, compacting, construction, trimming, and finishing (paving, gravel, etc.).

F.4.7.1.3 Pads. This element provides for a flat stable base for antennas, telescopes, and other structures or equipment. Pads are usually composed of concrete.

F.4.7.1.4 Retaining Walls / Fencing. These items retain earth, and can restrict vision and or passage to Ground equipment, housing, and other Ground facilities.

F.4.7.1.5 Utilities. This element delivers utility services (electricity, water, gas, etc.) up to Ground Buildings or to other structures and comprises the effort and resources for the installation of the utility infrastructure (electrical cables, pipes, transformers, etc.).

F.4.7.1.6 Site Preparation Other. This element contains all the resources associated with unique Site Preparations subsystem resource items not included in WBS elements above.

F.4.7.2 Landscape. This collection of items improves the appearance of the ground segment.

• Includes, for example:
• a. Trees, shrubs, or grass, altering the contours of the ground, or other aesthetic material or objects

F.4.7.3 Buildings 1…n (Specify). These items permanently support and shelter Ground equipment and occupancy use.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.7.3.1 Foundation and Sub Structure. This element transfers the weight of Buildings into the ground strata or earth. A common type of shallow foundation is a slab-on-grade foundation where the weight of the building is transferred to the soil through a concrete slab placed at the surface. Deeper foundations are used to transfer a load from a structure through an upper weak layer of soil to a stronger deeper layer of soil.

• Includes, for example:
• a. Helical piles
• b. Impact driven piles
• c. Drilled shafts, caissons, piers, and earth stabilized columns
• d. Basements and fallout shelters

F.4.7.3.2 Superstructure and Finishing. This element provides protection from the elements (wind, rain, sun, etc.) and partitioning for equipment and personnel. It includes, for example, roofing, walls, floors, framing, exterior and interior wall finishing. It excludes specialized flooring for computers and other equipment.

F.4.7.3.3 Buildings Other. This element contains all the resources associated with unique Building subsystem resource items not included in the WBS elements above.

F.4.7.4 Equipment and Building Fit Out 1…n (Specify). These elements adapt equipment and buildings for suitability to accomplish their designed purposes.

Includes, for example:

• a. Heating, venting, and air conditioning (HVAC)
• b. Power conditioning/ uninterrupted power supply (UPS)
• c. Network wiring/cable trays, generators
• d. Computer flooring, appliances
• e. Furniture and subsystem other items needed to build, service and operate the Space System Ground Segment

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.7.4.1 Heating Venting and Air Conditioning (HVAC). These elements maintain desired air temperatures and flow for comfort, safety, and proper operating environments. This includes equipment related to the heating, venting, and air conditioning (HVAC) needed to accommodate facilities and equipment at a Space System Ground site.

F.4.7.4.2 Power Conditioning/Uninterruptible Power Supplies (UPS). These elements provide stable electrical power within a Ground Terminal or Station.

• Includes, for example:
• a. Power conditioning units and Uninterruptible Power Supplies (UPS) themselves, as well as the building modifications, cabling, and other support hardware required for the installation and operation of the units

• Excludes, for example:
• a. Elements and related hardware external to and leading up to Buildings, which is included under Utilities within Site Preparation
• b. Motor generators (included within Generators)

F.4.7.4.3 Network Wiring/Cable Trays. This collection of items holds up and distributes cables and wiring. A cable tray system is a unit or assembly of units or sections (including associated fittings) that form a rigid structural system used to securely fasten or support cables and wiring. This element includes raceways.

F.4.7.4.4 Generators. These elements generate electrical energy, generally using electromagnetic induction. Generators are often employed for “back-up” electrical power generation for Ground equipment during extended periods when the normal electrical supply is interrupted. This includes motor generators.

F.4.7.4.5 Computer Flooring. This element provides a means of routing interconnecting cables and wires and often the cooled air required by computing and related electrical equipment. A computer floor is a raised floor in offices, labs, and stations with a high requirement for servicing/change-out.

• Includes, for example:
• a. Tiles
• b. Framing
• c. Structural support

F.4.7.4.6 Appliances. This element performs various simple or narrow functions, such as providing light. Appliances are usually operated electrically.

• Includes, for example:
• a. Lamps and other lighting
• b. Refrigerators and freezers
• c. Individual room heaters and air conditioners, sinks, toilets, etc.
• Excludes, for example:
• a. Telecommunications equipment and computer and network appliances such as servers and back-up units

F.4.7.4.7 Furniture. This collection of items supports the human body, provide storage, or hold objects. Storage furniture is used to hold or contain smaller objects such as tools, books, small equipment, and other goods.

• Includes, for example:
• a. Chairs, tables, desks, cabinets, and shelves

F.4.7.4.8 Equipment and Building Fit Out Other. This WBS element contains all the resources associated with unique Equipment and Building Fit Out subsystem items not included in WBS elements above.

F.4.7.5 Pre-Operations Maintenance 1…n (Specify). These subsystems contain all the resources related to the pre-operations (Pre-Ops) maintenance of the building(s) and other Facilities. This function begins with the completion and initial functioning of the items (buildings, roads, etc.) and ends with the start of Operations.

F.4.8 Vehicles and Shelters. These elements provide the ability for GOPCs and terminals to be transportable.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.8.1 Vehicles. The summing element is for powered vehicles used for transportable GOPCs and Terminals.

• Includes, for example:
• a. Trucks and humvees

F.4.8.1.1 Vehicle 1…n (Specify). These items include all the resources required for each unique vehicle.

F.4.8.2 Shelters. The summing element is for items that protect and house transportable GOPC and Ground Terminal equipment.

• Includes, for example:
• a. Shelters, trailers, and shells

F.4.8.2.1 Shelter 1…n (Specify). These items include all the resources required for each unique shelter. A shelter is usually made of foam-and-beam sandwich panels that consist of a polyurethane foam core, aluminum skins and a framework of high strength aluminum alloy extrusions.

F.4.8.3 Pre-Ops Maintenance 1…n (Specify). These elements contain all the resources related to the pre- operations (Pre-Ops) maintenance of the specified type of Vehicles and Shelters. This function begins with acceptance of the Vehicles and Shelters and ends with the start of Operations. F.4.9 Insurance. This element includes the resources pertaining to the acquisition and settlement of Insurance coverage for the entirety or portions of the Space System.

NOTE: For lower level Common Elements, e.g., SEIT/PM and Support Equipment, reference Appendix L, section L.4.

F.4.9.1 Insurance Policy. These elements are a form of risk management primarily used to hedge against the risk of loss. Insurance contracts or policies provide a means of controlling the cost impact of loss and/or damage to portions or all of the Space System.

• Includes, for example:
• a. Launch insurance
• b. On-orbit life insurance
• c. General liability coverage

F.4.9.2 Insurance Settlements. These items are the securities delivered (usually a credit payment) that satisfy the contractual obligations of the Insurance Policies above (e.g., an insurance payment to cover damage to Space Vehicle components due to a fire).

F.4.10 Task Orders. These items are miscellaneous services and products procured during the Space System acquisition under separate Task Order Contract Line Items (CLINS).

F.4.10.1 Task Order 1…n (Specify). These elements are for all the resource required to fulfill an individual Task Order.

F.4.11 Orbital Transfer Vehicle (OTV). This element is a single propulsion upper-stage that thrusts the Space Vehicle into a new orbit, for example, a low earth orbit to a medium or high earth orbit.

• Includes, for example:
• a. Inertial Upper Stage (IUS)
• b. Transfer Orbit Stage (TOS)
• c. Payload Assist Module (PAM), and Centaur

These elements are separate from the Space and Launch Vehicles. They can be solid or liquid propulsion systems. If the Booster Adapter is not captured under the Space Vehicle element, it should be captured within this element or the Launch Vehicle element.

• F.4.12 Launch Vehicle 1…n (Specify). A complete Launch Vehicle in a multiple or dissimilar Launch Vehicle configuration. This WBS element is intended for Launch Vehicle(s) that boost unmanned satellites into earth orbits. It contains all of the resources associated with the design, development, production, integration, assembly, and test to include verification testing of each Launch Vehicle as required, as well as commercial-like launch services. This element also includes the Launch Vehicle contractors’ efforts to receive, store, and transport the Launch Vehicle and associated Ground equipment; to stack and assemble the Launch Vehicle; to mate the Space Vehicle to the Launch Vehicle; to perform integrated system test and checkout; and to track and measure Launch Vehicle performance during the ascent phase. List each unique configuration as a separate Launch Vehicle using sequential indices for each configuration; e.g., first configuration is Launch Vehicle 1, second configuration is Launch Vehicle 2, etc. Includes, for example:
• a. Design, development, and production, integration, assembly, test, and checkout of complete units (i.e., the prototype or operationally configured units, which satisfy the requirements of their applicable specification, regardless of end use)
• b. If the Booster Adapter is not captured under the Space Vehicle element, it should be captured within this element or the OTV element.
• c. Payload fairings

NOTE: For lower level information, use the structure and definitions in Appendix J, Launch Vehicle if required.